Presentation 2019-08-22
[Invited Talk] Reconsideration of TDDB Statistics of Thick Dielectric Films Used in SiC/GaN Power/RF Devices and Image Sensors
Kenji Okada,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) Recent advances of GaN/SiC power devices, RF/MMIC (monolithic microwave integrated circuit) devices, and also Image Sensors have been increasing the importance of SiO2 and SiN-based THICK dielectric films (> ~20 nm). Because of their thicknesses and relatively low integrities, carrier charging under electrical stress prevents us from appropriately understanding their TDDB characteristics. This paper demonstrates the charging-induced dynamic stress relaxation (CiDSR) effect causes the misunderstanding of TDDB statistics in thick SiO2 and of the TDDB model of SiN films. Then, the constant-delta E model is proposed as an appropriate model for SiN film by suppressing the CiDSR effect. Furthermore, the anomalous thickness dependence of the Weibull slope is reported in both SiO2 and SiN films and the Generalized model is proposed to explain it by combining the conventional percolation model and the constant-delta E model.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) dielectrics / TDDB / Weibull slope / dielectric breakdown / image sensor / GaN / SiC / power device
Paper # R2019-25,EMD2019-23,CPM2019-24,OPE2019-52,LQE2019-30
Date of Issue 2019-08-15 (R, EMD, CPM, OPE, LQE)

Conference Information
Committee LQE / OPE / CPM / EMD / R
Conference Date 2019/8/22(2days)
Place (in Japanese) (See Japanese page)
Place (in English)
Topics (in Japanese) (See Japanese page)
Topics (in English)
Chair Hiroshi Aruga(Mitsubishi Electric) / Hiroshi Takahashi(Sophia Univ.) / Mayumi Takeyama(Kitami Inst. of Tech.) / Shinichi Wada(TMC System) / Akira Asato(Fujitsu)
Vice Chair Hiroshi Yasaka(Tohoku Univ.) / Goji Nakagawa(Fujitsu Labs.) / Yuichi Nakamura(Toyohashi Univ. of Tech.) / Yoshiki Kayano(Univ. of Electro-Comm.) / Tadashi Dohi(Hiroshima Univ.)
Secretary Hiroshi Yasaka(Furukawa Electric Industries) / Goji Nakagawa(Osaka Univ.) / Yuichi Nakamura(Tokyo Inst. of Tech.) / Yoshiki Kayano(NTT) / Tadashi Dohi(Hirosaki Univ.)
Assistant Fumito Nakajima(NTT) / Kenta Miura(Gunma Univ.) / Yuki Wakayama(Hitachi) / Yasuo Kimura(Tokyo Univ. of Tech.) / Tomoaki Terasako(Ehime Univ.) / Fumihiko Hirose(Yamagata Univ.) / Yuichi Hayashi(NAIST) / Hiroyuki Okamura(Hiroshima Univ.) / Shinji Yokogawa(Univ. of Electro-Comm.)

Paper Information
Registration To Technical Committee on Lasers and Quantum Electronics / Technical Committee on OptoElectronics / Technical Committee on Component Parts and Materials / Technical Committee on Electromechanical Devices / Technical Committee on Reliability
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) [Invited Talk] Reconsideration of TDDB Statistics of Thick Dielectric Films Used in SiC/GaN Power/RF Devices and Image Sensors
Sub Title (in English)
Keyword(1) dielectrics
Keyword(2) TDDB
Keyword(3) Weibull slope
Keyword(4) dielectric breakdown
Keyword(5) image sensor
Keyword(6) GaN
Keyword(7) SiC
Keyword(8) power device
1st Author's Name Kenji Okada
1st Author's Affiliation TowerJazz Panasonic Semiconductor Co., Ltd.(TowerJazz Panasonic Semiconductor)
Date 2019-08-22
Paper # R2019-25,EMD2019-23,CPM2019-24,OPE2019-52,LQE2019-30
Volume (vol) vol.119
Number (no) R-169,EMD-170,CPM-171,OPE-172,LQE-173
Page pp.pp.29-34(R), pp.29-34(EMD), pp.29-34(CPM), pp.29-34(OPE), pp.29-34(LQE),
#Pages 6
Date of Issue 2019-08-15 (R, EMD, CPM, OPE, LQE)