Presentation 2019-05-15
The real chip evaluation of Through Chip Interface IP for Renesas 65nm SOTB process
Hideharu Amano, Hideto Kayashima, Tsunaaki Shidei, Takuya Kojima,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English)
Keyword(in Japanese) (See Japanese page)
Keyword(in English)
Paper # VLD2019-5
Date of Issue 2019-05-08 (VLD)

Conference Information
Committee VLD / IPSJ-SLDM
Conference Date 2019/5/15(1days)
Place (in Japanese) (See Japanese page)
Place (in English) Ookayama Campus, Tokyo Institute of Technology
Topics (in Japanese) (See Japanese page)
Topics (in English) System Design, etc.
Chair Noriyuki Minegishi(Mitsubishi Electric) / Yutaka Tamiya(Fujitsu Lab.)
Vice Chair Nozomu Togawa(Waseda Univ.)
Secretary Nozomu Togawa(NTT) / (Univ. of Aizu)
Assistant / Hiroe Iwasaki(NTT)

Paper Information
Registration To Technical Committee on VLSI Design Technologies / Special Interest Group on System and LSI Design Methodology
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) The real chip evaluation of Through Chip Interface IP for Renesas 65nm SOTB process
Sub Title (in English)
Keyword(1)
Keyword(2)
Keyword(3)
1st Author's Name Hideharu Amano
1st Author's Affiliation Keio University(Keio Univ.)
2nd Author's Name Hideto Kayashima
2nd Author's Affiliation Keio University(Keio Univ.)
3rd Author's Name Tsunaaki Shidei
3rd Author's Affiliation Keio University(Keio Univ.)
4th Author's Name Takuya Kojima
4th Author's Affiliation Keio University(Keio Univ.)
Date 2019-05-15
Paper # VLD2019-5
Volume (vol) vol.119
Number (no) VLD-25
Page pp.pp.31-36(VLD),
#Pages 6
Date of Issue 2019-05-08 (VLD)