Presentation 2019-05-15
Study of new stacked type logic circuit scheme with fabrication technology of 3D flash memory
Fumiya Suzuki, Shigeyoshi Watanabe,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English)
Keyword(in Japanese) (See Japanese page)
Keyword(in English)
Paper # VLD2019-3
Date of Issue 2019-05-08 (VLD)

Conference Information
Committee VLD / IPSJ-SLDM
Conference Date 2019/5/15(1days)
Place (in Japanese) (See Japanese page)
Place (in English) Ookayama Campus, Tokyo Institute of Technology
Topics (in Japanese) (See Japanese page)
Topics (in English) System Design, etc.
Chair Noriyuki Minegishi(Mitsubishi Electric) / Yutaka Tamiya(Fujitsu Lab.)
Vice Chair Nozomu Togawa(Waseda Univ.)
Secretary Nozomu Togawa(NTT) / (Univ. of Aizu)
Assistant / Hiroe Iwasaki(NTT)

Paper Information
Registration To Technical Committee on VLSI Design Technologies / Special Interest Group on System and LSI Design Methodology
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Study of new stacked type logic circuit scheme with fabrication technology of 3D flash memory
Sub Title (in English)
Keyword(1)
1st Author's Name Fumiya Suzuki
1st Author's Affiliation Shonan Institute of technology(Shonan Inst. of Tech.)
2nd Author's Name Shigeyoshi Watanabe
2nd Author's Affiliation Shonan Institute of technology(Shonan Inst. of Tech.)
Date 2019-05-15
Paper # VLD2019-3
Volume (vol) vol.119
Number (no) VLD-25
Page pp.pp.19-23(VLD),
#Pages 5
Date of Issue 2019-05-08 (VLD)