Presentation | 2019-05-09 Study of new stacked type logic circuit scheme with fabrication technology of 3D flash memory. Fumiya Suzuki, Shigeyoshi Watanabe, |
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PDF Download Page | PDF download Page Link |
Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | |
Paper # | RECONF2019-4 |
Date of Issue | 2019-05-02 (RECONF) |
Conference Information | |
Committee | RECONF |
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Conference Date | 2019/5/9(2days) |
Place (in Japanese) | (See Japanese page) |
Place (in English) | Tokyo Tech Front |
Topics (in Japanese) | (See Japanese page) |
Topics (in English) | Reconfigurable system, etc. |
Chair | Masato Motomura(Tokyo Tech.) |
Vice Chair | Yuichiro Shibata(Nagasaki Univ.) / Kentaro Sano(RIKEN) |
Secretary | Yuichiro Shibata(Hiroshima City Univ.) / Kentaro Sano(e-trees.Japan) |
Assistant | Yuuki Kobayashi(NEC) / Hiroki Nakahara(Tokyo Inst. of Tech.) |
Paper Information | |
Registration To | Technical Committee on Reconfigurable Systems |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | Study of new stacked type logic circuit scheme with fabrication technology of 3D flash memory. |
Sub Title (in English) | |
Keyword(1) | |
1st Author's Name | Fumiya Suzuki |
1st Author's Affiliation | Shonan Institute of technology(Shonan Inst. of Tech.) |
2nd Author's Name | Shigeyoshi Watanabe |
2nd Author's Affiliation | Shonan Institute of technology(Shonan Inst. of Tech.) |
Date | 2019-05-09 |
Paper # | RECONF2019-4 |
Volume (vol) | vol.119 |
Number (no) | RECONF-18 |
Page | pp.pp.17-21(RECONF), |
#Pages | 5 |
Date of Issue | 2019-05-02 (RECONF) |