| Presentation | 2019-02-07 [Invited Talk] Fabrication of substrates with smooth Au surface for bonding at room temperature in atmospheric air Takashi Matsumae, Michitaka Yamamoto, Yuichi Kurashima, Eiji Higurashi, Hideki Takagi, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | e electroformed a Cu-based heat spreader with smooth Au thin film for room temperature bonding in atmospheric air. The Cu substrates were fabricated on Au/Ta/Cu (from bottom to top) seed layers deposited onto smooth thermally-oxidized Si wafers. As their exfoliated Au surface from SiO2 is atomically smooth as that of the Si wafer, the electroformed Cu substrate can form bonding with a Au-metallized Si chip at room temperature in atmospheric air. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Surface activated bonding / Room temperature bonding / Bonding in atmospheric air / Au nano-bonding layer / Electroforming |
| Paper # | SDM2018-97 |
| Date of Issue | 2019-01-31 (SDM) |
| Conference Information | |
| Committee | SDM |
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| Conference Date | 2019/2/7(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Backend / Assembly and Related materials technology |
| Chair | Takahiro Shinada(Tohoku Univ.) |
| Vice Chair | Hiroshige Hirano(TowerJazz Panasonic) |
| Secretary | Hiroshige Hirano(Shizuoka Univ.) |
| Assistant | Takahiro Mori(AIST) / Nobuaki Kobayashi(Nihon Univ.) |
| Paper Information | |
| Registration To | Technical Committee on Silicon Device and Materials |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | [Invited Talk] Fabrication of substrates with smooth Au surface for bonding at room temperature in atmospheric air |
| Sub Title (in English) | |
| Keyword(1) | Surface activated bonding |
| Keyword(2) | Room temperature bonding |
| Keyword(3) | Bonding in atmospheric air |
| Keyword(4) | Au nano-bonding layer |
| Keyword(5) | Electroforming |
| 1st Author's Name | Takashi Matsumae |
| 1st Author's Affiliation | National Institute of Advanced Industrial Science and Technology(AIST) |
| 2nd Author's Name | Michitaka Yamamoto |
| 2nd Author's Affiliation | National Institute of Advanced Industrial Science and Technology(AIST) |
| 3rd Author's Name | Yuichi Kurashima |
| 3rd Author's Affiliation | National Institute of Advanced Industrial Science and Technology(AIST) |
| 4th Author's Name | Eiji Higurashi |
| 4th Author's Affiliation | National Institute of Advanced Industrial Science and Technology(AIST) |
| 5th Author's Name | Hideki Takagi |
| 5th Author's Affiliation | National Institute of Advanced Industrial Science and Technology(AIST) |
| Date | 2019-02-07 |
| Paper # | SDM2018-97 |
| Volume (vol) | vol.118 |
| Number (no) | SDM-438 |
| Page | pp.pp.27-30(SDM), |
| #Pages | 4 |
| Date of Issue | 2019-01-31 (SDM) |