| Presentation | 2019-02-07 [Invited Talk] Ultrafine 3D Interconnect Technology Using Directed Self-Assembly Takafumi Fukushima, Murugesan Mariappan, Mitsumasa Koyanagi, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | A directed self-assembly (DSA) technology is applied to fabricate ultrafine pitch TSV (Through-Silicon Vias) for ultra-high density 3D storage memory systems. In addition, 3D chip bonding with fine-pitch Cu electrodes is also demonstrated. A nanocomposite consisting of an AB diblock copolymer and metal compounds/nanoparticles shows nano-cylinder structures on Si substrates based on a Flory-Huggins theory to interconnect between thin chips three-dimensionally stacked in layers. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Directed Self-Assembly (DSA) / Through-Silicon Via (TSV) / Fine-Pitch Electrode Bonding / 3D-Stacked LSI |
| Paper # | SDM2018-92 |
| Date of Issue | 2019-01-31 (SDM) |
| Conference Information | |
| Committee | SDM |
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| Conference Date | 2019/2/7(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Backend / Assembly and Related materials technology |
| Chair | Takahiro Shinada(Tohoku Univ.) |
| Vice Chair | Hiroshige Hirano(TowerJazz Panasonic) |
| Secretary | Hiroshige Hirano(Shizuoka Univ.) |
| Assistant | Takahiro Mori(AIST) / Nobuaki Kobayashi(Nihon Univ.) |
| Paper Information | |
| Registration To | Technical Committee on Silicon Device and Materials |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | [Invited Talk] Ultrafine 3D Interconnect Technology Using Directed Self-Assembly |
| Sub Title (in English) | |
| Keyword(1) | Directed Self-Assembly (DSA) |
| Keyword(2) | Through-Silicon Via (TSV) |
| Keyword(3) | Fine-Pitch Electrode Bonding |
| Keyword(4) | 3D-Stacked LSI |
| 1st Author's Name | Takafumi Fukushima |
| 1st Author's Affiliation | Tohoku University(Tohoku Univ.) |
| 2nd Author's Name | Murugesan Mariappan |
| 2nd Author's Affiliation | Tohoku University(Tohoku Univ.) |
| 3rd Author's Name | Mitsumasa Koyanagi |
| 3rd Author's Affiliation | Tohoku University(Tohoku Univ.) |
| Date | 2019-02-07 |
| Paper # | SDM2018-92 |
| Volume (vol) | vol.118 |
| Number (no) | SDM-438 |
| Page | pp.pp.5-8(SDM), |
| #Pages | 4 |
| Date of Issue | 2019-01-31 (SDM) |