| Presentation | 2019-02-07 [Invited Talk] Grain-Boundary-Crystallinity Dependence of Mechanical Properties and EM Resistance of Electroplated Copper Interconnections Yifan Luo, Yutaro Nakoshi, Ryota Mizuno, Ken Suzuki, Hideo Miura, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | |
| Paper # | SDM2018-94 |
| Date of Issue | 2019-01-31 (SDM) |
| Conference Information | |
| Committee | SDM |
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| Conference Date | 2019/2/7(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Backend / Assembly and Related materials technology |
| Chair | Takahiro Shinada(Tohoku Univ.) |
| Vice Chair | Hiroshige Hirano(TowerJazz Panasonic) |
| Secretary | Hiroshige Hirano(Shizuoka Univ.) |
| Assistant | Takahiro Mori(AIST) / Nobuaki Kobayashi(Nihon Univ.) |
| Paper Information | |
| Registration To | Technical Committee on Silicon Device and Materials |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | [Invited Talk] Grain-Boundary-Crystallinity Dependence of Mechanical Properties and EM Resistance of Electroplated Copper Interconnections |
| Sub Title (in English) | |
| Keyword(1) | |
| 1st Author's Name | Yifan Luo |
| 1st Author's Affiliation | Tohoku University(Tohoku Univ.) |
| 2nd Author's Name | Yutaro Nakoshi |
| 2nd Author's Affiliation | Tohoku University(Tohoku Univ.) |
| 3rd Author's Name | Ryota Mizuno |
| 3rd Author's Affiliation | Tohoku University(Tohoku Univ.) |
| 4th Author's Name | Ken Suzuki |
| 4th Author's Affiliation | Tohoku University(Tohoku Univ.) |
| 5th Author's Name | Hideo Miura |
| 5th Author's Affiliation | Tohoku University(Tohoku Univ.) |
| Date | 2019-02-07 |
| Paper # | SDM2018-94 |
| Volume (vol) | vol.118 |
| Number (no) | SDM-438 |
| Page | pp.pp.15-18(SDM), |
| #Pages | 4 |
| Date of Issue | 2019-01-31 (SDM) |