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| Presentation | 2015-12-03 10:50 [Invited Talk] Development of Via Structures in IC Package Substrates for Impedance Reduction Tomoyuki Akaboshi, Taiga Fukumori, Daisuke Mizutani, Motoaki Tani (Fujitsu Lab.) |
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| PDF Download Link |  CPM2015-136 ICD2015-61 Link to ES Tech. Rep. Archives: CPM2015-136 ICD2015-61 |
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