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| Presentation | 2014-08-22 14:25 Opto-electronic hybrid integrated chip packaging technology for silicon photonic platform using gold-stud bump bonding Mitsuo Usui, Kotaro Takeda, Hirooki Hirata, Hiroshi Fukuda, Tai Tsuchizawa, Hidetaka Nishi, Rai Kou, Tatsuro Hiraki, Kentaro Honda, Masafumi Nogawa, Koji Yamada, Tsuyoshi Yamamoto (NTT) |
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| PDF Download Link |  R2014-45 EMD2014-50 CPM2014-65 OPE2014-75 LQE2014-49 Link to ES Tech. Rep. Archives: EMD2014-50 CPM2014-65 OPE2014-75 LQE2014-49 |
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