Information and Systems-Image Engineering(Date:2023/02/07)

Presentation
[Invited Talk] Atomic Layer and Conformal Etching Technologies of 3D Structures in Advanced Logic and Memory Devices

Hiroto Ohtake(Hitachi High-Tech Corp.),  

[Date]2023-02-07
[Paper #]SDM2022-86
[Invited Talk] Applications of the surface activated bonding on heterogeneous Integration at room temperature

Tadatomo Suga(Meisei Univ.),  

[Date]2023-02-07
[Paper #]SDM2022-89
[Invited Talk] Metal-induced line width variability challenge and mitigation strategy in advanced post-Cu interconnects

Koichi Motoyama(IBM),  

[Date]2023-02-07
[Paper #]SDM2022-85
[Invited Talk] Next-generation wearable devices: Skin electronics

Sunghoon Lee(Univ. of Tokyo),  

[Date]2023-02-07
[Paper #]SDM2022-92
[Invited Talk] Pixel Pitch Hybrid Bonding and Three Layer Stacking Technology for BSI

Kazumasa Tanida(TPSCo),  Shigeru Suzuki(TPSCo),  Toshiki Seo(TPSCo),  Yasunori Morinaga(TPSCo),  Hayato Korogi(TPSCo),  Michinari Tetani(TPSCo),  Masakazu Hamada(TPSCo),  Ryuji Eto(TPSCo),  Takeshi Yamashita(TPSCo),  Yasuhiro Kato(TPSCo),  Naoaki Sato(TPSCo),  Tadami Shimizu(TPSCo),  Tetsuro Hanawa(TPSCo),  Hiroko Kubo(TPSCo),  Fumitaka Ito(TPSCo),  Yoshihiro Noguchi(TPSCo),  Masayuki Nakamura(TPSCo),  Ryuji Mizukoshi(TPSCo),  Masahiko Takeuchi(TPSCo),  Masakatsu Suzuki(TPSCo),  Naoto Niisoe(TPSCo),  Isao Miyanaga(TPSCo),  Atsushi Ikeda(TPSCo),  Susumu Matsumoto(TPSCo),  

[Date]2023-02-07
[Paper #]SDM2022-88
[Invited Talk] New Approach for Epoxy Mold Compound Slurry in Advanced Packaging Technology

Shogo Arata(Resonac),  Chiaki Noda(Resonac),  Yasuhiro Ichige(Resonac),  Satoyuki Nomura(Resonac),  Trianggono Widodo(Intel),  Nagatoshi Tsunoda(Intel),  Xavier Brun(Intel),  

[Date]2023-02-07
[Paper #]SDM2022-90
[Invited Talk] Advanced process technologies for continuous logic scaling towards 2nm node and beyond

Tomonari Yamamoto(TEL),  

[Date]2023-02-07
[Paper #]SDM2022-87
[Invited Talk] Temperature Dependence of Information Processing Performance of Ionic Liquid Type Intelligent Connection Device

Masakazu Kobayashi(NAGASE),  Hisashi Shima(AIST),  Yasuhisa Naitoh(AIST),  Hiroyuki Akinaga(AIST),  Dan Sato(TUS),  Takuma Matsuo(TUS),  Masaharu Yonezawa(TUS),  Kentaro Kinoshita(TUS),  Toshiyuki Itoh(Toyota Phys. & Chem. Res. Inst.),  Toshiki Nokami(Tottori Univ),  Yasumitsu Orii(NAGASE),  

[Date]2023-02-07
[Paper #]SDM2022-91