Information and Systems-Image Engineering(Date:2021/02/05)

Presentation
[Invited Talk] Ru Area Selective Metal Capping and Wafer Surface Condition Control for sub-30nm Pitch Cu Damascene Interconnect

Hirokazu Aizawa(TTCA),  Kaoru Maekawa(TTCA),  Kai-Hung Yu(TTCA),  Gyana Pattanaik(TTCA),  Gert Leusink(TTCA),  

[Date]2021-02-05
[Paper #]SDM2020-55
[Invited Talk] Bumpless Build Cube (BBCube) using Wafer-on-Wafer (WOW) Technology with 3D Redundancy Scheme

Shinji Sugatani(Titech),  Norio Chujo(Titech),  Koji Sakui(Titech),  Hiroyuki Ryoson(Titech),  Tomoji Nakamura(Titech),  Takayuki Ohba(Titech),  

[Date]2021-02-05
[Paper #]SDM2020-61
Limitation of barrier property of ultra-thin TaN film

Toshihiro Kuge(Tohoku Univ.),  Masataka Yahagi(Tohoku Univ.),  Junichi Koike(Tohoku Univ.),  

[Date]2021-02-05
[Paper #]SDM2020-57
Characteristic properties of Co?Zr alloy as a single?layer barrier

Yuki Yamada(Tohoku Univ.),  Masataka Yahagi(Tohoku Univ.),  Junichi Koike(Tohoku Univ.),  

[Date]2021-02-05
[Paper #]SDM2020-56
[Invited Talk] AI for material, material for AI

Shintaro Yamamichi(IBM Japan),  

[Date]2021-02-05
[Paper #]SDM2020-59
[Invited Talk] Impacts of Misalignment on 1um Pitch Cu-Cu Hybrid Bonding

Yoshihisa Kagawa(SSS),  Takumi Kamibayashi(SSS),  Masaki Haneda(SSS),  Nobuotoshi Fujii(SSS),  Syunsuke Furuse(SSS),  Hideto Hashiguch(SSS),  Tomoyuki Hirano(SSS),  Hayato Iwamoto(SSS),  

[Date]2021-02-05
[Paper #]SDM2020-58
[Invited Talk] R&D of 3D-IC Technology in the era of AI, IoT, Big data

Katsuya Kikuchi(AIST),  

[Date]2021-02-05
[Paper #]SDM2020-60