Information and Systems-Image Engineering(Date:2018/02/08)

Presentation
[Invited Talk] Low temperature Cu-Cu bonding by transient liquid phase sintering of mixed Cu nanoparticles and Sn-Bi eutectic powders

Muhammad Khairi Faiz(Waseda Univ.),  Takehiro Yamamoto(Waseda Univ.),  Tadatomo Suga(Tokyo Univ.),  Tomoyuki Miyashita(Waseda Univ.),  Makoto Yoshida(Waseda Univ.),  

[Date]2018-02-08
[Paper #]SDM2017-102
[Invited Talk] Next Generation Circuit Fabrication by Molecular Bonding Technology

Akihiko Happoya(Toshiba),  Kunio Mori(SCL),  

[Date]2018-02-08
[Paper #]SDM2017-103
[Invited Talk] Cluster-Preforming-Deposited Amorphous WSin (n = 12) Insertion Film of Low SBH and High Diffusion Barrier for Direct Cu Contact

Naoya Okada(AIST),  Noriyuki Uchida(AIST),  Shinichi Ogawa(AIST),  Kazuhiko Endo(AIST),  Toshihiko Kanayama(AIST),  

[Date]2018-02-08
[Paper #]SDM2017-97
[Invited Talk] Low cost solder-TSV technology for automobile application

Atsushi Mizutani(DENSO),  Yuki Ohara(DENSO),  Yuki Inagaki(DENSO),  Kazushi Asami(DENSO),  

[Date]2018-02-08
[Paper #]SDM2017-101
[Invited Talk] A Novel Role for SiCN to Suppress H2O Outgas from TEOS oxide films in wafer bonding

Michinari Tetani(TPSCo),  Yasunori Morinaga(TPSCo),  Masakazu Hamada(TPSCo),  Masahiko Takeuchi(TPSCo),  Shinji Uya(TPSCo),  Hisashi Yano(TPSCo),  Naoaki Sato(TPSCo),  Susumu Matsumoto(TPSCo),  

[Date]2018-02-08
[Paper #]SDM2017-99
[Invited Talk] In-situ Analysis of Corrosion inhibitor behavior of Co surface

Toshiaki Shibta(Mitsubishi Chemical Corp.),  Tomohiro Kusano(Mitsubishi Chemical Corp.),  Ken Harada(Mitsubishi Chemical Corp.),  Kan Takeshita(Mitsubishi Chemical Corp.),  Yasuhiro Kawase(Mitsubishi Chemical Corp.),  

[Date]2018-02-08
[Paper #]SDM2017-100
[Invited Talk] Characteristics of Cobalt alloy for low resistivity contact in sub 10 nm FinFET

Junichi Koike(Tohoku Univ.),  Maryamsadat Hosseini(Tohoku Univ.),  Daisuke Ando(Tohoku Univ.),  Yuji Sutou(Tohoku Univ.),  

[Date]2018-02-08
[Paper #]
[Invited Talk] Moisture Barrier Properties of Capping Graphene for Copper Metallization

Kazuyoshi Ueno(SIT),  Ploybussara Gomasang(SIT),  Takumi Abe(SIT),  Kenji Kawahara(Kyushu Univ.),  Yoko Wasai(Horiba Techno),  Nguyen Thanh Cuong(NIMS),  Nataliya Nabatova-Gabain(Horiba Techno),  Hiroki Ago(Kyushu Univ.),  Susumu Okada(Univ. Tsukuba),  

[Date]2018-02-08
[Paper #]SDM2017-98