Engineering Sciences/NOLTA-Reliability(Date:2003/04/18)

Presentation
表紙

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[Date]2003/4/18
[Paper #]
目次

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[Date]2003/4/18
[Paper #]
Development of Athermal AWG Module

Junichi HASEGAWA,  Tsunetoshi SAITO,  Kazutaka NARA,  Yoshinobu NEKADO,  Kanji TANAKA,  Kazuhisa KASHIHARA,  

[Date]2003/4/18
[Paper #]R2003-1,CPM2003-1,OPE2003-1
A Surface Mountable 10Gbit/s Optical Receiver Module

Kenji KOGO,  Tatemi IDO,  Masato SHISHIKURA,  Yasunobu MATSUOKA,  Shigehisa TANAKA,  Satoru KIKUCHI,  Katsuhiko KUBOKI,  Hiroshi HAMADA,  

[Date]2003/4/18
[Paper #]R2003-2,CPM2003-2,OPE2003-2
Development of 4-channels 1.3/1.55μm Bi-directional Transceiver

Hiromi NAKANISHI,  Takeshi OKADA,  Seiji TAKAHASHI,  Takeshi FUJIMOTO,  Kenji HIRAYAMA,  Akira YAMAGUCHI,  Yoshiki KUHARA,  

[Date]2003/4/18
[Paper #]R2003-3,CPM2003-3,OPE2003-3
3D-MEMS Optical Switch using Roof-type Retroreflector

Tamotsu AKASHI,  Shinichi TAKEUCHI,  Tsuyoshi YAMAMOTO,  Kazuyuki MORI,  Satoshi UEDA,  Masaaki KAWAI,  

[Date]2003/4/18
[Paper #]R2003-4,CPM2003-4,OPE2003-4
Gain Equalizer Using Double Etalon Filters for WDM Optical Communication

Takurou Asano,  Kenji Andou,  Yasuo Hirose,  

[Date]2003/4/18
[Paper #]R2003-5,CPM2003-5,OPE2003-5
Small chirp 40Gbps EA-modulator with high optical output power capability

Yasunori MIYAZAKI,  Norio OKADA,  Takayoshi SUGAI,  Hitoshi TADA,  Toshiharu MIYAHARA,  Kazuhisa TAKAGI,  Toshitaka AOYAGI,  Tatsuo HATTA,  Etsuji OMURA,  

[Date]2003/4/18
[Paper #]R2003-6,CPM2003-6,OPE2003-6
Optical Interconnection on IC Chips for Future Ultra-High Speed O/E Packages

Atsushi ARATAKE,  Tomoyuki AKEYOSHI,  Masami TOKUMITSU,  

[Date]2003/4/18
[Paper #]R2003-7,CPM2003-7,OPE2003-7
Opto-electronic Chip-on-film (OE-COF) Packaging Technology Using Optical Waveguide Films with Low Coefficients of Thermal Expansion

Mitsuo USUI,  Shigeki ISHIBASHI,  Nobutatsu KOSHOUBU,  Suzuko ISHIZAWA,  Hirooki HIRATA,  Hideyuki TAKAHARA,  

[Date]2003/4/18
[Paper #]R2003-8,CPM2003-8,OPE2003-8
Examples of Photonics Device Mounting Using High Precision Flip-Chip Bonding

Eiji TANAKA,  Masaaki YAMAMOTO,  

[Date]2003/4/18
[Paper #]R2003-9,CPM2003-9,OPE2003-9
Assembly Technique and Reliability of the Laser Module with Wavelength Locker

Atsushi MIKI,  Hiroyuki YABE,  Toshio TAKAGI,  

[Date]2003/4/18
[Paper #]R2003-10,CPM2003-10,OPE2003-10
Microfocus X-ray CT analysis method and Its application for high-density LSI packaging

Akira HIRAKIMOTO,  Tadahiro SHIOTA,  Taketo KISHI,  EDAHIRO Masami /,  Masayuki KAMEGAWA,  Masaaki UKITA,  

[Date]2003/4/18
[Paper #]R2003-11,CPM2003-11,OPE2003-11
Degradation analysis of a semiconductor optical amplifier (SOA)

Hiroyuki KAMIOKA,  Tatsuya TAKESHITA,  Katsuaki MAGARI,  Toshio ITO,  Yuichi TOHMORI,  

[Date]2003/4/18
[Paper #]R2003-12,CPM2003-12,OPE2003-12
石英系PLC型光スイッチの信頼性の検討(光部品の実装,信頼性)

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[Date]2003/4/18
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[新フェロー特別講演]ベイズの定理の変遷と信頼性への応用(光部品の実装、信頼性)

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[Date]2003/4/18
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複写される方へ

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[Date]2003/4/18
[Paper #]
奥付

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[Date]2003/4/18
[Paper #]