Engineering Sciences/NOLTA-Reliability(Date:1995/11/10)

Presentation
表紙

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[Date]1995/11/10
[Paper #]
目次

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[Date]1995/11/10
[Paper #]
The Reliability of pd plating on SMD

Hirohumi Koyama,  Tetsuaki Wada,  

[Date]1995/11/10
[Paper #]R95-19
Development of high density package by stacking IC chips

Katsunobu Mori,  Hiroyuki Nakanishi,  Atsuya Narai,  Toshiya Ishio,  Satoru Fukunaga,  kazuya Fujita,  Morihiro Kada,  

[Date]1995/11/10
[Paper #]R95-20
Novel Moisture Soaking Techniques of Soldering Heat Test for Surface Mount LSIs

Koji Okada,  Masaki Tanaka,  

[Date]1995/11/10
[Paper #]R95-21
Reliability and technical concern on high capacitive chip ceramic capacitors

Kenji Murata,  Toshimi Kawakami,  Teruo Agawa,  

[Date]1995/11/10
[Paper #]R95-22
The Study of ESD Destructive Mechanism for pn-junction.

Nobuyuki Wakai,  Masayoshi Tsutsumi,  Takashi Setoya,  

[Date]1995/11/10
[Paper #]R95-23
The analysis techniques for the gate oxide leakage

Takuya Naoe,  Hirotaka Komoda,  Shinji Yoshioka,  

[Date]1995/11/10
[Paper #]R95-24
Effect of Plasma-Induced Damage on MOSFET Reliability

Hajime Watanabe,  Junko Komori,  Keiichi Higashitani,  Yoji Mashiko,  Hiroshi Koyama,  

[Date]1995/11/10
[Paper #]R95-25
Reliability of High Voltage Power DMOSFET

I Minekawa,  T. Wada,  

[Date]1995/11/10
[Paper #]R95-26
A Method for Determining the Optimal Initial-Production Contro1-Period Based on a Reliability Growth Model

Yasumichi Tatsumi,  Mitsuhiro Kimura,  Shigeru Yamada,  

[Date]1995/11/10
[Paper #]R95-27
A Markovian Software Availability Modeling with a Geometrically Decreasing Hazard Rate

Keiko Takata,  Koichi Tokuno,  Shigeru Yamada,  

[Date]1995/11/10
[Paper #]R95-28
[OTHERS]

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[Date]1995/11/10
[Paper #]