Electronics-Silicon Devices and Materials(Date:2019/02/07)

Presentation
[Invited Talk] Stress Investigation of Annular-Trench-Isolated (ATI) Through Silicon Via (TSV)

Wei Feng(AIST),  Naoya Watanabe(AIST),  Haruo Shimamoto(AIST),  Masahiro Aoyagi(AIST),  Katsuya Kikuchi(AIST),  

[Date]2019-02-07
[Paper #]SDM2018-93
[Invited Talk] New contact material for advanced CMOS: cluster-preforming-deposited amorphous Si-rich W silicide film

Naoya Okada(AIST),  Noriyuki Uchida(AIST),  Shinichi Ogawa(AIST),  Toshihiko Kanayama(AIST),  

[Date]2019-02-07
[Paper #]SDM2018-96
[Invited Talk] Half pitch 14 nm direct pattering with Nanoimprint lithography

Tetsuro Nakasugi(Toshiba Memory),  

[Date]2019-02-07
[Paper #]SDM2018-91
[Invited Talk] Grain-Boundary-Crystallinity Dependence of Mechanical Properties and EM Resistance of Electroplated Copper Interconnections

Yifan Luo(Tohoku Univ.),  Yutaro Nakoshi(Tohoku Univ.),  Ryota Mizuno(Tohoku Univ.),  Ken Suzuki(Tohoku Univ.),  Hideo Miura(Tohoku Univ.),  

[Date]2019-02-07
[Paper #]SDM2018-94
[Invited Talk] Ultrafine 3D Interconnect Technology Using Directed Self-Assembly

Takafumi Fukushima(Tohoku Univ.),  Murugesan Mariappan(Tohoku Univ.),  Mitsumasa Koyanagi(Tohoku Univ.),  

[Date]2019-02-07
[Paper #]SDM2018-92
[Invited Talk] Single Crystal Al Interconnects formed on p-GaN and their Application to GaN FET

Takeshi Harada(Panasonic),  Koji Utaka(Panasonic),  Yusuke Kand(Panasonic),  Katsuhiko Onishi(Panasonic),  Keiichi Matsunaga(Panasonic),  Masahiro Hikita(Panasonic),  Yasuhiro Uemoto(Panasonic),  

[Date]2019-02-07
[Paper #]SDM2018-95
[Invited Talk] Fabrication of substrates with smooth Au surface for bonding at room temperature in atmospheric air

Takashi Matsumae(AIST),  Michitaka Yamamoto(AIST),  Yuichi Kurashima(AIST),  Eiji Higurashi(AIST),  Hideki Takagi(AIST),  

[Date]2019-02-07
[Paper #]SDM2018-97
[Invited Talk] High-precision Dual Damascene Fabrication Technique

Takashi Hayakawa(TEL),  Makoto(TEL),  Syuji Nozawa(TEL),  Tatsuya Yamaguchi(TEL),  

[Date]2019-02-07
[Paper #]