Electronics-Silicon Devices and Materials(Date:2017/02/06)

Presentation
[Invited Talk] Impact of Dry Process Damage on Chemical Mechanical Planarization with Cu/low-k Structure

Masako Kodera(Toshiba),  Hiroyuki Yano(Toshiba),  Naoto Miyashita(Toshiba),  

[Date]2017-02-06
[Paper #]SDM2016-139
[Invited Talk] Huge-potential need to the memory-system for ultra-long term preservation and its issues

Toshio Kobayashi(SIT),  

[Date]2017-02-06
[Paper #]SDM2016-142
[Invited Talk] NiGe/Ge contact formation by microwave annealing method for low-thermal budget processing

Osamu Nakatsuka(Grad. Sch. of Eng., Nagoya University),  Yoshimasa Watanabe(TEL),  Akihiro Suzuki(Grad. Sch. of Eng., Nagoya University),  Yoshio Nishi(Dept. of Electrical Engineering, Stanford University),  Shigeaki Zaima(IMaSS, Nagoya University),  

[Date]2017-02-06
[Paper #]SDM2016-141
[Invited Talk] Direct Cu metallization on TGV Glass substrate using Wet Process.

Kotoku Inoue(Koto),  Masatoshi Takayama(Koto),  Tsubasa Fujimura(Koto),  Shigeo Onitake(Koto),  

[Date]2017-02-06
[Paper #]SDM2016-146
[Invited Talk] Large Scale Crossbar Switch Block (CSB) with Via-Switch for a Low-Power FPGA

Naoki Banno(NEC Corp.),  Munehiro Tada(NEC Corp.),  Koichiro Okamoto(NEC Corp.),  Noriyuki Iguchi(NEC Corp.),  Toshitsugu Sakamoto(NEC Corp.),  Hiromitsu Hada(NEC Corp.),  Hiroyuki Ochi(Ritsumeikan Univ.),  Hidetoshi Onodera(Kyoto Univ.),  Masanori Hashimoto(Osaka Univ.),  Tadahiko Sugibayashi(NEC Corp.),  

[Date]2017-02-06
[Paper #]SDM2016-144
[Invited Talk] Electrical coupling of stacked transistors in monolithic three-dimensional inverters and its dependence on the interlayer dielectric thickness

Junichi Hattori(AIST),  Koichi Fukuda(AIST),  Toshifumi Irisawa(AIST),  Hiroyuki Ota(AIST),  Tatsuro Maeda(AIST),  

[Date]2017-02-06
[Paper #]SDM2016-143
[Invited Talk] Development of a Wet Cleaning Process for High-Yield Formation of via-last TSVs

Naoya Watanabe(AIST),  Hidekazu Kikuchi(LAPIS),  Azusa Yanagisawa(LAPIS),  Haruo Shimamoto(AIST),  Katsuya Kikuchi(AIST),  Masahiro Aoyagi(AIST),  Akio Nakamura(LAPIS),  

[Date]2017-02-06
[Paper #]SDM2016-145
[Invited Talk] Fabrication of High-Quality Metalic Films for ULSI by ALD

Yukihiro Shimogaki(UTokyo),  

[Date]2017-02-06
[Paper #]SDM2016-140
[Invited Talk] Properties of amorphous Co alloys having liner/barrier function in advanced LSI interconnection

Maryamsadat Hosseini(Tohoku Univ.),  Hiroyuki Koide(Tohoku Univ.),  Kazuki Watanabe(Tohoku Univ.),  Daisuke Ando(Tohoku Univ.),  Yuji Sutou(Tohoku Univ.),  Junichi Koike(Tohoku Univ.),  

[Date]2017-02-06
[Paper #]