Electronics-Silicon Devices and Materials(Date:2016/01/22)

Presentation
Characteristic of TiNx film by low temperature deposition using radical treatment

Masaru Sato(Kitami inst. of Technol.),  Mayumi B. Takeyama(Kitami inst. of Technol.),  Atsushi Noya(Kitami inst. of Technol.),  

[Date]2016-01-22
[Paper #]SDM2015-113
Copper Thin Film Growth using Cu(I) Amidinate Precursor in Supercritical Carbon Dioxide

Md Rasadujjaman(Univ. Yamanashi),  Mitsuhiro Watanabe(Univ. Yamanashi),  Hiroshi Sudoh(Gas phase growth),  Hideaki Machida(Gas phase growth),  Eiichi Kondoh(Univ. Yamanashi),  

[Date]2016-01-22
[Paper #]SDM2015-110
Fabrication of Multilayer Graphene by Solid-Phase Precipitation with Current Stress

MD Sahab Uddin(SIT),  Hiroyasu Ichikawa(SIT),  Shota Sano(SIT),  Kazuyoshi Ueno(SIT/RCGI),  

[Date]2016-01-22
[Paper #]SDM2015-115
In-situ ellipsometry of Cu surfaces immersed in BTA-H2O2 solutions

Tatsuya Kawakami(University of Yamanashi),  Eiichi Kondoh(University of Yamanashi),  Mitsuhiro Watanabe(University of Yamanashi),  Satomi Hamada(Ebara Corporation),  Shohei Shima(Ebara Corporation),  Hirokuni Hiyama(Ebara Corporation),  

[Date]2016-01-22
[Paper #]SDM2015-111
[Invited Talk] Re-think Stress migration phenomenon with Stress measurement in 12years

Hideya Matsuyama(Socionext),  Takashi Suzuki(FJ Lab),  Tomoji Nakamura(FJ Lab),  Motoki Shiozu(MIFS),  Hideo Ehara(MIFS),  

[Date]2016-01-22
[Paper #]SDM2015-109
Fabrication of highly reliable Co(W) thin film by physical vapor deposition for next generation ULSI Cu interconnects

Taewoong Kim(Univ. of Tokyo),  Kouta Tomita(Univ. of Tokyo),  Takeshi Momose(Univ. of Tokyo),  Takaaki Tsunoda(CANON ANELVA),  Takayuki Moriwaki(CANON ANELVA),  Yukihiro Shimogaki(Univ. of Tokyo),  

[Date]2016-01-22
[Paper #]SDM2015-114
[Invited Talk] Reliability Results of 4 million Micro Bump Interconnections of 3D Stacked 16 M Pixel Image Sensor

Yoshiaki Takemoto(Olympus),  Naohiro Takazawa(Olympus),  Mitsuhiro Tsukimura(Olympus),  Haruhisa Saito(Olympus),  Toru Kondo(Olympus),  Hideki Kato(Olympus),  Jun Aoki(Olympus),  Kenji Kobayashi(Olympus),  Shunsuke Suzuki(Olympus),  Yuichi Gomi(Olympus),  Seisuke Matsuda(Olympus),  Yoshitaka Tadaki(Olympus),  

[Date]2016-01-22
[Paper #]SDM2015-108
[Invited Talk] Packaging Material for 2.5D/3D TSV Integration

Kazuyuki Mitsukura(Hitachi Chemical),  Tatsuya Makino(Hitachi Chemical),  Keiichi Hatakeyama(Hitachi Chemical),  Kenneth June Rebibis(IMEC),  Andy Miller(IMEC),  Eric Beyne(IMEC),  

[Date]2016-01-22
[Paper #]SDM2015-118
[Invited Talk] Novel reconfigured wafer-to-wafer(W2W) hybrid bonding technology using ultra-high density nano-Cu filaments for exascale 2.5D/3D integration

Kangwook Lee(Tohoku Univ.),  Taksfumi Fukushima(Tohoku Univ.),  Tetsu Tanaka(Tohoku Univ.),  Mitsumasa Koyanagi(Tohoku Univ.),  

[Date]2016-01-22
[Paper #]SDM2015-117
[Invited Talk] TSV Process Technology by Printing

Hiroaki Ikeda(Napra),  Shigenobu Sekine(Napra),  Ryuji Kimura(Napra),  koichi Shimokawa(Napra),  keiji Okada(Napra),  Hiroaki Shindo(Napra),  Tatsuya Ooi(Napra),  Rei Tamaki(Napra),  Makoto Nagata(Kobe-Univ.),  

[Date]2016-01-22
[Paper #]SDM2015-119
[Invited Talk] characterization of nitride thin film deposited at low temperatures

Mayumi B. Takeyama(Kitami inst.),  Masaru Sato(Kitami inst.),  Yasushi Kobayashi(Fujitsu Lab.),  Yoshihiro Nakata(Fujitsu Lab.),  Tomoji Nakamura(Fujitsu Lab.),  Atsushi Noya(Kitami inst.),  

[Date]2016-01-22
[Paper #]SDM2015-112
[Invited Talk] Effect of Wafer Thinning on DRAM Characteristics for Bumpless Interconnects and WOW Applications

Y. S. Kim(Tokodai),  S. Kodama(Tokodai),  Y. Mizushima(Tokodai),  T. Nakamura(Tokodai),  N. Maeda(Tokodai),  K. Fujimoto(Tokodai),  A. Kawai(DISCO),  T. Ohba(Tokodai),  

[Date]2016-01-22
[Paper #]SDM2015-116