Electronics-Silicon Devices and Materials(Date:2014/02/21)

Presentation
表紙

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[Date]2014/2/21
[Paper #]
目次

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[Date]2014/2/21
[Paper #]
Large-Radius Neutral Beam Enhanced Chemical Vapor Deposition Process for Non-Porous Ultra-low-k SiOCH

Yoshiyuki KIKUCHI,  Seiji SAMUKAWA,  

[Date]2014/2/21
[Paper #]SDM2013-165
Trend of practical technology in advanced low-k integration

Naoya INOUE,  

[Date]2014/2/21
[Paper #]SDM2013-166
Impact of Back Grind Damage on Si Wafer Thinning for 3D Integration

Yoriko Mizushima,  Youngsuk Kim,  Tomoji Nakamura,  Ryuichi Sugie,  Hideki Hashimoto,  Akira Uedono,  Takayuki Ohba,  

[Date]2014/2/21
[Paper #]SDM2013-167
TSVの高速形成に向けた有機系導電インクの注入手法(配線・実装技術と関連材料技術)

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[Date]2014/2/21
[Paper #]SDM2013-168
Integrated Circuits in Future : How do we find opportunity and challenge of integrated circuits?

Kazuya Masu,  

[Date]2014/2/21
[Paper #]SDM2013-169
Novel Implantation Process of Carbon Nanotubes for Plugs and Vias, and their Integration with Transferred Multilayer Graphene Wire Obtained by Annealing Sputtered Amorphous Carbon

Motonobu Sato,  Makoto Takahashi,  Mizuhisa Nihei,  Shintaro Sato,  Naoki Yokoyama,  

[Date]2014/2/21
[Paper #]SDM2013-170
Low temperature growth of dense carbon nanotube arrays on conductive underlayers

Suguru NODA,  Nuri NA,  Takashi SHIRAI,  Keisuke NOMURA,  Kei HASEGAWA,  

[Date]2014/2/21
[Paper #]SDM2013-171
TSV Liner Formation with Vapor Deposited Polyimides

Takafumi FUKUSHIMA,  Murugesan MARIAPPAN,  Ji-Ceol BEA,  Kang-Wook LEE,  Mitsumasa KOYANAGI,  

[Date]2014/2/21
[Paper #]SDM2013-172
15μm-pitch Bump Interconnections Relied on Flip-chip Bonding Technique : for Advanced Chip Stacking Applications

Masahiro AOYAGI,  Thanh-Tung BUI,  Fumiki KATO,  Naoya WATANABE,  Shunsuke NEMOTO,  Katsuya KIKUCHI,  

[Date]2014/2/21
[Paper #]SDM2013-173
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[Date]2014/2/21
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[Date]2014/2/21
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[Date]2014/2/21
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[Date]2014/2/21
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