Electronics-Silicon Devices and Materials(Date:2013/01/28)

Presentation
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[Date]2013/1/28
[Paper #]
目次

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[Date]2013/1/28
[Paper #]
Improved Thermal Conductivity by Vertical Graphene Contact Formation for Thermal TSV

Akio KAWABATA,  Mizuhisa NIHEI,  Tomo MURAKAMI,  Motonobu SATO,  Naoki YOKOYAMA,  

[Date]2013/1/28
[Paper #]SDM2012-150
CuSn/InAu μ-bump induced local deformation and mechanical stress in high-density 3D-LSI

Murugesan Mariappan,  Mitsumasa Koyanagi,  

[Date]2013/1/28
[Paper #]SDM2012-151
Smart Interconnect Technology using Atom Switch for Low-power Programmable Logic

Munehiro TADA,  Toshitsugu SAKAMOTO,  Makoto MIYAMURA,  Naoki BANNO,  Koichiro OKAMOTO,  Noriyuki IGUCHI,  Hiromitsu HADA,  

[Date]2013/1/28
[Paper #]SDM2012-152
Nano-ordered Evaluation for Local Distribution of Adhesion Strength Between Cu/Dielectric in LSI Circuit

Shoji KAMIYA,  Hisashi SATO,  Masaki OMIYA,  Nobuyuki SHISHIDO,  Kozo KOIWA,  Masahiro NISHIDA,  Tomoji NAKAMURA,  Toshiaki SUZUKI,  Takeshi NOKUO,  Takashi SUZUKI,  

[Date]2013/1/28
[Paper #]SDM2012-153
Wafer-level chip scale package for white LED with high thermal dissipation

Yosuke Akimoto,  Akihiro Kojima,  Miyoko Shimada,  Hideyuki Tomizawa,  Hideto Furuyama,  Susumu Obata,  Kazuhito Higuchi,  Yoshiaki Sugizaki,  Hideki Shibata,  

[Date]2013/1/28
[Paper #]SDM2012-154
High Reliability Technology of Fine Pitch Re-wiring for High Density Chip Package : Cu Re-wiring Covering with Metal-Cap Barrier Technology

Tsuyoshi KANKI,  Junya IKEDA,  Shoichi SUDA,  Yasushi KOBAYASHI,  Yoshihiro NAKATA,  Tomoji NAKAMURA,  

[Date]2013/1/28
[Paper #]SDM2012-155
Novel Seed Layer Formation Using Electroless Copper Deposition For High Aspect Ratio TSV

Fumihiro INOUE,  Shoso SHINGUBARA,  Harold Philipsen,  

[Date]2013/1/28
[Paper #]SDM2012-156
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