Electronics-Silicon Devices and Materials(Date:2009/02/02)

Presentation
表紙

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[Date]2009/2/2
[Paper #]
目次

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[Date]2009/2/2
[Paper #]
The Integrated CMOS-MEMS Technology and Its Application

Katsuyuki MACHIDA,  Hiroki MORIMURA,  Shinichiro MUTOH,  Yasuhiro SATO,  

[Date]2009/2/2
[Paper #]SDM2008-206
Dual Damascene Integration Technology Featuring Short TAT Silylated Porous Silica (k=2.1) for 32nm node and beyond

Noriaki ODA,  Shinichi CHIKAKI,  Takeo KUBOTA,  Shinichi NAKAO,  Kazuhiro TOMIOKA,  Eiichi SODA,  Naofumi NAKAMURA,  Jun NOGAWA,  Yoshitsugu KAWASHIMA,  Ryo HAYASHI,  Shuichi SAITO,  

[Date]2009/2/2
[Paper #]SDM2008-207
Low-power Cu Interconnects with Damage-less Full Molecular-Pore-Stack (MPS) SiOCH for 32nm-node LSIs and Beyond

Makoto UEKI,  Masayoshi TAGAMI,  Naoya INOUE,  Fuminori ITO,  Ippei KUME,  Hironori YAMAMOTO,  Jun KAWAHARA,  Ken-ichiro HIJIOKA,  Tsuneo TAKEUCHI,  Shinobu SAITO,  Takahiro ONODERA,  Naoya FURUTAKE,  Norio OKADA,  Yoshihiro HAYASHI,  

[Date]2009/2/2
[Paper #]SDM2008-208
A Cost-effective Air-gap Interconnect Technology by All-in-One Post-Removing Process

N. Nakamura,  N. Matsunaga,  M. Wada,  T. Kaminatsui,  K. Watanabe,  H. Shibata,  

[Date]2009/2/2
[Paper #]SDM2008-209
Copper Line Resistance Control and Reliability Improvement by Surface Nitridation of Ti barrier Metal

A. Sakata,  S. Kato,  Yano Y. /,  H. Toyoda,  T. Kawanoue,  M. Hatano,  J. Wada,  N. Yamada,  T. Oki,  H. Yamaguchi,  N. Nakamura,  K. Higashi,  M. Yamada,  T. Fujimaki,  M. Hasunuma,  

[Date]2009/2/2
[Paper #]SDM2008-210
Electrochemical Etching of Ru Film for Bevel Cleaning of Back End of Line

Hidemitsu Aoki,  Daisuke Watanabe,  Naoki Ooi,  Jong-Hyeon J.,  Chiharu Kimura,  Takashi Sugino,  

[Date]2009/2/2
[Paper #]SDM2008-211
Galvanic Corrosion Control in Chemical Mechanical Polishing Step for Cu Interconnects with Ruthenium Barrier Film

Koji MARUYAMA,  Morio SHIOHARA,  Kouji YAMADA,  Seiichi KONDO,  Shuichi SAITO,  

[Date]2009/2/2
[Paper #]SDM2008-212
Development of high-performance passive devices and its circuit application

Hideki Hatakeyama,  Yusuke Uemichi,  Noboru Ishihara,  Kazuya Masu,  

[Date]2009/2/2
[Paper #]SDM2008-213
Investigation of Interconnect Design on Chip Package Interaction and Mechanical Reliability of Cu/low-k Multi-Layer Interconnect in Flip Chip Package

Chihiro J. UCHIBORI,  Michael Lee,  Xeufeng Zhang,  Paul S. Ho,  Tomoji Nakamura,  

[Date]2009/2/2
[Paper #]SDM2008-214
Enhanced Power Supply Structure with New Mesh Wiring and Electroless Plated Shunt Line and Assembly-Stress-Relaxation Structure

Yutaka Itoh,  Yukitoshi Ota,  Kazuhiro Ishikawa,  Fumito Itoh,  Chikako Karatani,  Koji Koike,  Taichi Nishio,  Hiroshige Hirano,  

[Date]2009/2/2
[Paper #]SDM2008-215
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[Date]2009/2/2
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[Date]2009/2/2
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[Date]2009/2/2
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