Electronics-Silicon Devices and Materials(Date:2006/01/30)

Presentation
表紙

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[Date]2006/1/30
[Paper #]
目次

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[Date]2006/1/30
[Paper #]
Film Characterization and Integration of UV Cured Ultra Low-k for 45nm Node Cu/Low-k Interconnects

Kinya Goto,  Shinobu Hashii,  Masahiro Matsumoto,  Noriko Miura,  Takeshi Furusawa,  Masazumi Matsuura,  Akihiko Ohsaki,  

[Date]2006/1/30
[Paper #]SDM2005-250
Mechanism of Moisture Uptake Induced Via Failure and its Impact on 45nm Node Interconnect Design

T. Fujimaki,  K. Higashi,  N. Nakamura,  N. Matsunaga,  K. Yoshida,  M. Hatano,  M. Hasunuma,  J. Wada,  T. Nishioka,  K. Akiyama,  H. Kawashima,  Y. Enomoto,  T. Hasegawa,  K. Honda,  M. Iwai,  S. Yamada,  F. Matsuoka,  

[Date]2006/1/30
[Paper #]SDM2005-251
Chip-level Performance Maximization using ASIS (Application-specific Interconnect Structure) Wiring Design Concept for 45nm node

Noriaki Oda,  Hironori Imura,  Naoyoshi Kawahara,  Masayoshi Tagami,  Hiroyuki Kunishima,  Shuji Sone,  Sadayuki Ohnishi,  Kenta Yamada,  Yumi Kakuhara,  Makoto Sekine,  Yoshihiro Hayashi,  Kazuyoshi Ueno,  

[Date]2006/1/30
[Paper #]SDM2005-252
Cu surface treatment using a hot-filament hydrogen radical source

Eiichi KONDOH,  Masaya FUKASAWA,  

[Date]2006/1/30
[Paper #]SDM2005-253
Deoxidization of Cu Oxide under Extremely Low Oxygen Pressure

Kazuhiko Endo,  Naoki Shirakawa,  Yoshiyuki Yoshida,  Shin-ichi Ikeda,  Tetsuya Mino,  Eishi Gofuku,  Eiichi Suzuki,  

[Date]2006/1/30
[Paper #]SDM2005-254
Influence of Cu-CMP Process on Defects in SiOC Films and TDDB Reliability

Nobuhiro Konishi,  Youhei Yamada,  Junji Noguchi,  Tomoko Jimbo,  

[Date]2006/1/30
[Paper #]SDM2005-255
45nm-node Dual Damascene Interconnects with Low-oxygen-content Cu-alloy

Mari ABE,  Munehiro TADA,  Hiroto OHTAKE,  Naoya FURUTAKE,  Mitsuru NARIHIRO,  Koichi ARAI,  Tsuneo TAKEUCH,  Shinobu SAITO,  Fuminori ITO,  Hiroki YAMAMOTO,  Masayoshi TAGAMI,  Noriaki ODA,  Makoto SEKINE,  Yoshihiro HAYASHI,  

[Date]2006/1/30
[Paper #]SDM2005-256
Stress-Induced Voiding under Vias Connected to "Narrow" Copper Lines

T. Kouno,  T. Suzuki,  S. Otsuka,  T. Hosoda,  T. Nakamura,  Y. Mizushima,  M. Shiozu,  H. Matsuyama,  K. Shono,  H. Watatani,  Y. Ohkura,  M. Sato,  S. Fukuyama,  M. Miyajima,  

[Date]2006/1/30
[Paper #]SDM2005-257
Stress Analyses of BEOL Structure with Copper Interconnects

Masako KODERA,  Shigeru KAKINUMA,  Giuseppe PEZZOTTI,  

[Date]2006/1/30
[Paper #]SDM2005-258
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[Date]2006/1/30
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[Date]2006/1/30
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[Date]2006/1/30
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