Electronics-Silicon Devices and Materials(Date:2005/01/24)

Presentation
表紙

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[Date]2005/1/24
[Paper #]
目次

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[Date]2005/1/24
[Paper #]
On-Chip Transmission Line for Long Global Interconnects

Hiroyuki ITO,  Junpei INOUE,  Shinichiro GOMI,  Hideyuki SUGITA,  Kenichi OKADA,  Kazuya MASU,  

[Date]2005/1/24
[Paper #]SDM2004-235
Futures of microcavity to distribute high-frequency clock over than 10GHz

T. Kohori,  H. Kato,  E. Kondoh,  T. Akitsu,  

[Date]2005/1/24
[Paper #]SDM2004-236
Application of Electro-Chemical Polishing in DI water to Cu damascene wiring planarization process

Ikutarou Noji,  Itsuki Kobata,  Hozumi Yasuda,  Takeshi Iizumi,  Masayuki Kumekawa,  Yutaka Wada,  Akira Fukunaga,  Manabu Tsujimura,  Yasushi Toma,  Tsukuru Suzuki,  Takayuki Saitoh,  

[Date]2005/1/24
[Paper #]SDM2004-237
Evaluation of pores in low-k porous silica films incorporated with ethylene groups

Yasutaka UCHIDA,  Toshiyuki OHDAIRA,  Ryoichi SUZUKI,  Yoshiyuki MARUYAMA,  Tomohiro KATOH,  Koichi ISHIDA,  

[Date]2005/1/24
[Paper #]SDM2004-238
Strategy for Highly-Reliable Porous Low-k Films : Mechanism of Time-Dependent Dielectric-Constant Increase (TDDI)

Daisuke RYUZAKI,  Haruaki SAKURAI,  Koichi ABE,  Kenichi TAKEDA,  Hiroshi FUKUDA,  

[Date]2005/1/24
[Paper #]SDM2004-239
Highly Reliable PVD/ALD/PVD Stacked Barrier Metal Structure for 45nm-Node Copper Dual-Damascene Interconnects

Kazuyuki HIGASHI,  Hitomi YAMAGUCHI,  Seiichi OMOTO,  Atsuko SAKATA,  Tomio KATATA,  Noriaki MATSUNAGA,  Hideki SHIBATA,  

[Date]2005/1/24
[Paper #]SDM2004-240
Thermally Robust Cu Interconnects with Cu-Ag alloy for Sub 45nm Node

A. Isobayashi,  Y. Enomoto,  H. Yamada,  S. Takahashi,  S. Kadomura,  

[Date]2005/1/24
[Paper #]SDM2004-241
Improvement in Reliability of Cu Dual-Damascene Interconnects Using CuAl Alloy Seed

Kazuyoshi MAEKAWA,  Kenichi MORI,  Kiyoteru KOBAYASHI,  Masahiro YONEDA,  Niranjan Kumar,  Schubert Chu,  Samuel Chen,  Gigi Lai,  Daniel Diehl,  

[Date]2005/1/24
[Paper #]SDM2004-242
Effect of Additives on Bottom-up Electroless Copper Plating

S. Shingubara,  R. Obata,  A. Kato,  Z. Wang,  O. Yaegashi,  H. Sakaue,  T. Takahagi,  

[Date]2005/1/24
[Paper #]SDM2004-243
Metallization using Supercritical Carbon Dioxide Fluids

E. Kondoh,  

[Date]2005/1/24
[Paper #]SDM2004-244
NCS/Cu Multilevel Interconnects for 65nm node and beyond

I. Sugiura,  Y. Nakata,  N. Misawa,  S. Otsuka,  N. Nishikawa,  Y. Iba,  F. Sugimoto,  Y. Setta,  H. Sakai,  Y. Koura,  Y. Mizushima,  T. Suzuki,  H. Kitada,  K. Nakano,  T. Karasawa,  Y. Ohkura,  T. Kouno,  H. Watatani,  S. Nakai,  M. Nakaishi,  N. Shimizu,  S. Fukuyama,  T. Nakamura,  M. Miyajima,  E. Yano,  

[Date]2005/1/24
[Paper #]SDM2004-245
Pore-structure Control of Interlayer Dielectric Films for Low-power Operational ULSI Devices

Yoshihiro Hayashi,  Fuminori Itoh,  Munehiro Tada,  Hiroto Ohtake,  Masayuki Tagami,  Makoto Ueki,  Kenichiro Hijioka,  Mari Abe,  

[Date]2005/1/24
[Paper #]SDM2004-246
Challenge of low-k materials for 130, 90, 65nm node interconnect technology and beyond

H. Miyajima,  K. Watanabe,  K. Fujita,  S. Ito,  K. Tabuchi,  T. Shimayama,  K. Akiyama,  T. Hachiya,  K. Higashi,  N. Nakamura,  A. Kajita,  N. Matsunaga,  Y. Enomoto,  R. Kanamura,  M. Inohara,  K. Honda,  H. Kamijo,  R. Nakata,  H. Yano,  N. Hayasaka,  T. Hasegawa,  S. Kadomura,  H. Shibata,  T. Yoda,  

[Date]2005/1/24
[Paper #]SDM2004-247
裏表紙

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[Date]2005/1/24
[Paper #]