Electronics-Silicon Devices and Materials(Date:1998/01/23)

Presentation
表紙

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[Date]1998/1/23
[Paper #]
目次

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[Date]1998/1/23
[Paper #]
Self-planarizing low-k intermetal dielectric CVD using organicsilane and hydrogen peroxide

Masazumi Matsuura,  

[Date]1998/1/23
[Paper #]SDM97-178
Fabrication of Intermetal Dielectric Films with a Low Dielectric Constant Using Ion-Implanted Organic SOG

Kaori Misawa,  Naoteru Matsubara,  Hiroyuki Watanabe,  Yoshio Okayama,  Hideki Mizuhara,  Shin-ichi Tanimoto,  Yasunori Inoue,  Hiroshi Hanafusa,  Keiichi Yodoshi,  

[Date]1998/1/23
[Paper #]SDM97-179
Highly Reliable SiOF Film Formation by HDP-CVD Using Fluorosilanes

T. Fukuda,  T. Hosokawa,  E. Sasaki,  N. Kobayashi,  

[Date]1998/1/23
[Paper #]SDM97-180
Influence of Hydrogen Absorption by Titanium Film in Interconnections on MOS Transistor Characteristics in Annealing Process

Takahisa Yamaha,  Seiji Hirade,  Fujio Masuoka,  

[Date]1998/1/23
[Paper #]SDM97-181
A novel design method based on the accurate estimation of the reliability of wirings for gigabit DRAMs

Shigeyoshi WATANABE,  

[Date]1998/1/23
[Paper #]SDM97-182
Electromigration Performance of the Al-Si-Cu filled Vias with Titanium Glue Layer

Makiko Kageyama,  Keiichi Hashimoto,  Hiroshi Onoda,  

[Date]1998/1/23
[Paper #]SDM97-183
Application of Al_3Hf/Hf Bilayered Film to the Al Metallization System as a Diffusion Barrier

Satoko Shinkai,  Katsutaka Sasaki,  Yoshio Abe,  Hideto Yanagisawa,  

[Date]1998/1/23
[Paper #]SDM97-184
Low Resistive Selective CVD-W Via Plug on TiN by Using F_2 (Ar) Plasma Pre-treatment

Akihiro Kajita,  Kazuyuki Higashi,  Noriaki Matsunaga,  Hideki Shibata,  Johta Fukuhara,  Katsuhiko Ohya,  Kazuyuki Masukawa,  Kenitch Ohtsuka,  

[Date]1998/1/23
[Paper #]SDM97-185
[OTHERS]

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[Date]1998/1/23
[Paper #]