Electronics-Silicon Devices and Materials(Date:1994/07/26)

Presentation
表紙

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[Date]1994/7/26
[Paper #]
目次

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[Date]1994/7/26
[Paper #]
Initial stage of oxidation of hydrogen-terminated silicon surfaces

Takeo Hatori,  

[Date]1994/7/26
[Paper #]SDM94-45
Influence of LOCOS Process Condition and Active Pattern Direction on Junction Leakage Current

Masahiro Itoh,  Yoshimune Habutsu,  Shigeki Kuroda,  Yoshiki Nagatomo,  Masayoshi Ino,  

[Date]1994/7/26
[Paper #]SDM94-46
Stress-Induced Low-Level Leakage Mechanism in Ultrathin Silicon Dioxide Films

Mikihiro Kimura,  Hiroshi Koyama,  

[Date]1994/7/26
[Paper #]SDM94-47
End Point Detection of Oxide Etch by Using Plasma Chemistry Monitor

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[Date]1994/7/26
[Paper #]
Currtent Problems in the Application of the Ta_2O_5 Dielectrics to the DRAM Capacitors

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[Date]1994/7/26
[Paper #]
Low reverse-bias current n^+p-junction formation by 450℃ furnace annealing

Mauricid Massazumi Oka,  Akira Nakada,  Kazuo Tomita,  Tadashi Shibata,  Tadahiro Ohmi,  Takahisa Nita,  

[Date]1994/7/26
[Paper #]SDM94-50
Thermal Warpage in Silicon Wafer with Off-axis

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[Date]1994/7/26
[Paper #]
Investigation on Diffusion Barrier Layers between Cu and Si

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[Date]1994/7/26
[Paper #]
An SiN diffusion barrier technology using ECR nitrogen plasma for polycide gate electrodes

Tetsuo Hosoya,  Katsuyuki Machida,  Kazuo Imai,  Eisuke Arai,  

[Date]1994/7/26
[Paper #]SDM94-53
Analysis of Ti-silicided films on fine poly-Si patterns

Hideharu Yahata,  Takahiro Nagano,  Naoki Yamamoto,  Nozomu Matsuzaki,  

[Date]1994/7/26
[Paper #]SDM94-54
Structral and Electrical Properties of TiN/Al/TiN_x in CMOS device

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[Date]1994/7/26
[Paper #]
Migration Reliability Testing of Giant-Grain Copper Interconnects by a Palsed-Current Stressing Technique

Toshiyuki Takewaki,  Hisashi Yamada,  Tadashi Shibata,  Tadahiro Ohmi,  Takahisa Nitta,  

[Date]1994/7/26
[Paper #]SDM94-56
Soft-Error Simulation System

Shigeo Satoh,  Ritsuo Sudo,  Hiroko Tashiro,  Noriaki Nakayama,  Nobuo Sasaki,  

[Date]1994/7/26
[Paper #]SDM94-57
[OTHERS]

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[Date]1994/7/26
[Paper #]