Electronics-Silicon Devices and Materials(Date:1994/01/28)

Presentation
表紙

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[Date]1994/1/28
[Paper #]
目次

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[Date]1994/1/28
[Paper #]
5000-μm Line-and-Space Planarization Using Chemical Mechanical Pol ishing

Sadahiro Kishii,  Hiromasa Hoko,  Hiroshi Horie,  Yoshihiro Arimoto,  

[Date]1994/1/28
[Paper #]SDM93-190
A Global Planarization Technology using Defocused Resist Patteroning with Blanket Stripe Mask

Yoshihisa Matsubara,  Ko Noguchi,  Koichirou Okumura,  

[Date]1994/1/28
[Paper #]SDM93-191
A silicon nitride antireflection film

Fumio Ohara,  Jun Sakakibara,  Seiji Fujino,  Tadashi Hattori,  

[Date]1994/1/28
[Paper #]SDM93-192
Characteristics of ECR CVD Ti and Contact formation

Takaaki Miyamoto,  Hirofumi Sumi,  Yukiyasu Sugano,  

[Date]1994/1/28
[Paper #]SDM93-193
Molecular simulation of surface processes in W-CVD using SiH_4 and WF_6

Takuya Maruizumi,  Jiroo Ushio,  Ryootaroo Irie,  Yoshiaki Takemura,  Ken Yamaguchi,  Nobuyoshi Kobayashi,  Masato Ikegawa,  

[Date]1994/1/28
[Paper #]SDM93-194
Preparation of SrTiO_3 high dielectric constant thin films by RF sputtering

Masayuki Fujii,  Youichiro Nakanishi,  Yoshinori Hatanaka,  

[Date]1994/1/28
[Paper #]SDM93-195
Deep submicron via filling technology of copper interconnection using blanket copper CVD

Nobuyoshi Awaya,  Yoshinobu Arita,  

[Date]1994/1/28
[Paper #]SDM93-196
Mutilevel Planarized-Trench-Aluminum(PTA)Interconnection using Reflow Spurttering and chemical Mechanical Polishing

Kuniko Kikuta,  Tutomu Nakajima,  Yoshihiro Hayashi,  Kazuyoshi Ueno,  Takamaro Kikkawa,  

[Date]1994/1/28
[Paper #]SDM93-197
Products Formed by Al-alloy High-Temperature-Sputter Deposition and Their Effects on Interconnect Reliability

Keiichi Hashimoto,  Kenshin Touchi,  Hiroshi Onoda,  

[Date]1994/1/28
[Paper #]SDM93-198
Effect of TiN/Ti cap layers on electromigration performance of Al based multi-layered interconnects

Yasunori Inoue,  Shin-ichi Tanimoto,  Kazutoshi Tsujimura,  Tomio Yamashita,  Yoshikazu Ibara,  Yasuhiko Yamashita,  Kiyoshi Yoneda,  

[Date]1994/1/28
[Paper #]SDM93-199
Improvement of EM Resistance by Aging Treatment for AlCu Multilayered Line

Takenao Nemoto,  Takeshi Nogami,  

[Date]1994/1/28
[Paper #]SDM93-200
[OTHERS]

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[Date]1994/1/28
[Paper #]