Electronics-Integrated Circuits and Devices(Date:2005/09/02)

Presentation
表紙

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[Date]2005/9/2
[Paper #]
目次

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[Date]2005/9/2
[Paper #]
The study of the high frequency electrical characteristics in high-speed digital device mounting : The Characteristic of high speed transmission of Flip-Chip Mounting

Chihiro Ueda,  

[Date]2005/9/2
[Paper #]CPM2005-96,ICD2005-106
Analysis of Transmission Characteristic of High-speed Differential Signal Bus

Tsuyoshi TOKIWA,  Toshio SUDO,  Nobuhiro TSURUTA,  Yoshihiro NISHIDA,  

[Date]2005/9/2
[Paper #]CPM2005-97,ICD2005-107
Measuemnt and Discussion of Degradation of Pulse Feature according with Line Length Increase

Koichi Yabuuchi,  Tamotsu Usami,  Yutaka Akiyama,  Kanji Otsuka,  

[Date]2005/9/2
[Paper #]CPM2005-98,ICD2005-108
Lead-free bumping and its process integrity for fine pitch interconnects

Hirokazu Ezawa,  Masaharu Seto,  Kazuhito Higuchi,  

[Date]2005/9/2
[Paper #]CPM2005-99,ICD2005-109
PKG基板高接続信頼性を表面処理技術の開発(LSIシステムの実装・モジュール化・インタフェース技術, テスト技術)

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[Date]2005/9/2
[Paper #]CPM2005-100,ICD2005-110
Simultaneous Switching Noise(SSN) and EMI of a Semiconductor Package

Takanobu KUSHIHIRA,  Toshio SUDO,  

[Date]2005/9/2
[Paper #]CPM2005-101,ICD2005-111
Study of 6Gbps Operation on 0.18um Node CMOS I/O Inverter with Transmission Structure in Signal and Power distribution Lines

Yutaka Akiyama,  Tsuneo Ito,  Kyoji Ito,  Kanji Otsuka,  

[Date]2005/9/2
[Paper #]CPM2005-102,ICD2005-112
Measurement of Inner-chip Variation and Signal Integrity By a 90-nm Large-scale TEG

Masaharu Yamamoto,  Yayoi Hayasi,  Hitoshi Endo,  Hiroo Masuda,  

[Date]2005/9/2
[Paper #]CPM2005-103,ICD2005-113
On Chip Transmission Line Interconnect

Kazuya MASU,  Kenichi OKADA,  Hiroyuki ITO,  

[Date]2005/9/2
[Paper #]CPM2005-104,ICD2005-114
複写される方へ

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[Date]2005/9/2
[Paper #]
Notice about photocopying

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[Date]2005/9/2
[Paper #]
奥付

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[Date]2005/9/2
[Paper #]