Electronics-Integrated Circuits and Devices(Date:2004/01/30)

Presentation
表紙

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[Date]2004/1/30
[Paper #]
目次

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[Date]2004/1/30
[Paper #]
Semiconductor package thermal analysis : Thermal analysis of the hotspot

Masanobu NAESHIRO,  

[Date]2004/1/30
[Paper #]CPM2003-176,ICD2003-215
Vibration Fatigue Reliability of BGA-IC Package with Pb-free solder and Pb-Sn solder

Young-Bae KIM,  Hiroshi NOGUCHI,  Masazumi AMAGAI,  

[Date]2004/1/30
[Paper #]CPM2003-177,ICD2003-216
Development of the Chip on Chip structure Package Utilizing Ultrasonic Flip-Chip Bonding

Toshihiro IWASAKI,  Keiichiro WAKAMIYA,  Yasumichi HATANAKA,  Yoshihiro TOMITA,  Michitaka KIMURA,  

[Date]2004/1/30
[Paper #]CPM2003-178,ICD2003-217
Examination of highly reliable Pb-free solder

Yoshitaka TOYODA,  Takeshi TASHIMA,  Masazumi AMAGAI,  

[Date]2004/1/30
[Paper #]CPM2003-179,ICD2003-218
Ultra-Thin High-Density Packaging Substrate for High-Performance CSPs and SiPs

Tadanori SHIMOTO,  Kazuhiro BABA,  Hideya MURAI,  Wataru URANO,  Hironori OHTA,  Jun TSUKANO,  Takehiko MAEDA,  Keiichiro KATA,  

[Date]2004/1/30
[Paper #]CPM2003-180,ICD2003-219
IC-Package Manufacturing System Based on Object Oriented Technology

Hiroaki SAMIZU,  Hiroaki NOSE,  Takashi NISHIDA,  

[Date]2004/1/30
[Paper #]CPM2003-181,ICD2003-220
Intra-Chip High-Speed Data Transfer Scheme Based on Autonomous Distributed Bus Control

Takashi TAKEUCHI,  Akira MOCHIZUKI,  Takahiro HANYU,  

[Date]2004/1/30
[Paper #]CPM2003-182,ICD2003-221
The Technology of System in Package for High-speed Transmission

Akira MIYOTA,  Nobukatsu SAITO,  Atsushi KIKUCHI,  Yoshiyuki YONEDA,  Mitsutaka SATO,  Makoto IIJIMA,  

[Date]2004/1/30
[Paper #]CPM2003-183,ICD2003-222
Transmission Line Power Supply for Over GHz Data Transmission

Keisuke SAITO,  Yutaka AKIYAMA,  Chihiro UEDA,  Tamotsu USAMI,  Kanji OTSUKA,  Tadatomo SUGA,  

[Date]2004/1/30
[Paper #]CPM2003-184,ICD2003-223
Analyses of Large Scale PWB with Parallel-Distributed 3-Dimension Electromagnetic Simulator " BLESS"

Takayuki WATANABE,  Hidemasa KUBOTA,  Kenji ARAKI,  Hideki ASAI,  

[Date]2004/1/30
[Paper #]CPM2003-185,ICD2003-224
Notes on error factors and estimation in 3-diniensional electromagnetic field simulations

Hidemasa KUBOTA,  Takayuki WATANABE,  Kenji ARAKI,  Hideki ASAI,  

[Date]2004/1/30
[Paper #]CPM2003-186,ICD2003-225
Relationships between LSI Power Supply Network and Switching Noise and Electromagnetic Radiation

Toshio SUDO,  Ken NAKANO,  

[Date]2004/1/30
[Paper #]CPM2003-187,ICD2003-226
The research for characteristic of the power and ground plane governed by the uncombined inductance

Takashi IIDA,  Tatsuya NAGATA,  Seiji MIYAMOTO,  Toshihiro MATSUNAGA,  Hideko ANDO,  

[Date]2004/1/30
[Paper #]CPM2003-188,ICD2003-227
Development of Low-loss and Low-noise PWB Technologies

Tetsuro YAMADA,  Masahiro SUZUKI,  Yasuhiro YONEDA,  Daisuke MIZUTANI,  Tatsuhiko TAJIMA,  

[Date]2004/1/30
[Paper #]CPM2003-189,ICD2003-228
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[Date]2004/1/30
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[Date]2004/1/30
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