Electronics-Integrated Circuits and Devices(Date:2003/01/24)

Presentation
表紙

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[Date]2003/1/24
[Paper #]
目次

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[Date]2003/1/24
[Paper #]
A Method for Estimating and Enhancing Test Quality Using Layout Information : A basic method and a few examoles (bridge fault Iddq test, weighted stuck-at fault coverage)

Yasuyuki NOZUYAMA,  Noriyuki HONDA,  Noriko YAMAGUCHI,  Yoshitomo NAKANISHI,  

[Date]2003/1/24
[Paper #]CPM2002-152,ICD2002-197
Eigen-Signatures for Regularity-based I_ Testing

Yukio OKUDA,  

[Date]2003/1/24
[Paper #]CPM2002-153,ICD2002-198
An Application of I_
spectrum method as the post I_ test method

Kazuhiro SAKAGUCHI,  

[Date]2003/1/24
[Paper #]CPM2002-154,ICD2002-199
Vector Memory Expansion System For The Old Logic Tester

Yoshikazu Takahashi,  Kazuhiro Yamada,  

[Date]2003/1/24
[Paper #]CPM2002-155,ICD2002-200
Diagnostic method with coupling capacitance information for completely open defect

Iwao YAMAZAKI,  Yasuo SATO,  Hiroki YAMANAKA,  

[Date]2003/1/24
[Paper #]CPM2002-156,ICD2002-201
Novel Wafer-level Testing Scheme for Capacitive Fingerprint Sensor LSI's with Pixel Self-check

Toshishige SHIMAMURA,  Hiroki MORIMURA,  Satoshi SHIGEMATSU,  Yukio OKAZAKI,  Katsuyuki MACHIDA,  Hakaru KYURAGI,  

[Date]2003/1/24
[Paper #]CPM2002-157,ICD2002-202
High-Performance FCBGA based on Multi-Layer Thin-Substrate Packaging Technology

Tadanori SHIMOTO,  Katsumi KIKUCHI,  Hirokazu HONDA,  Keiichiro KATA,  Kazuhiro BABA,  Koji MATSUI,  

[Date]2003/1/24
[Paper #]CPM2002-158,ICD2002-203
Ultra-Sonic Flip-Chip Interconnection Technology of Chip on Chip : Interconnection Technology for System in Package

Fumihiko ANDO,  Masanori NATSUAKI,  Akira TAKASHIMA,  Hiroshi KOBAYASHI,  Hidehiko KIRA,  Yasunori SASAKI,  Yukio OZAKI,  Mami NAGATAKE,  Nobutaka ITO,  

[Date]2003/1/24
[Paper #]CPM2002-159,ICD2002-204
High Speed Transmission and Power Ground Characteristics of Flip-chip BGA Package Over 2,000pin counts

Kazuyuki NAKAGAWA,  Masaki WATANABE,  Shinji BABA,  Keitaro YAMAGISHI,  Yuuichi SASAKI,  Masaaki NAMATAME,  Michitaka KIMURA,  

[Date]2003/1/24
[Paper #]CPM2002-160,ICD2002-205
The Gigabit Transmission Lines which used Low Loss Dielectric Materials

Yoshifumi TAKADA,  Tetsu SUZUKI,  Masao OGIHARA,  Takashi MATSUMOTO,  Norio SENGOKU,  

[Date]2003/1/24
[Paper #]CPM2002-161,ICD2002-206
Development of Embedded Passive Circuits using LTCC

Masao OGIHARA,  Yoshifumi TAKADA,  Takashi MATSUMOTO,  Takayuki UDA,  

[Date]2003/1/24
[Paper #]CPM2002-162,ICD2002-207
Low cost MMIC package for ultra high frequency signal transmission

Shinya Iijima,  Yoshikatsu Ishizuki,  Nobuyuki Hayashi,  Masataka Mizukoshi,  Satoshi Masuda,  Toshihiro Shimura,  

[Date]2003/1/24
[Paper #]CPM2002-163,ICD2002-208
Packaging Technology for High Performance UNIX Server

Masateru Koide,  Jie Wei,  Akihiko Fujisaki,  Yoshinori Uzuka,  Masahiro Suzuki,  

[Date]2003/1/24
[Paper #]CPM2002-164,ICD2002-209
A Variable Drivability (VD) Output Buffer for the System In a Package (SIP) and High Frequency Wafer test

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[Date]2003/1/24
[Paper #]CPM2002-165,ICD2002-210
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[Date]2003/1/24
[Paper #]
奥付

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[Date]2003/1/24
[Paper #]