Electronics-Integrated Circuits and Devices(Date:2001/12/13)

Presentation
表紙

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[Date]2001/12/13
[Paper #]
目次

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[Date]2001/12/13
[Paper #]
EB / FIB INtegrated Test System

Koji NAKAMAE,  Hiromu FUJIOKA,  

[Date]2001/12/13
[Paper #]CPM-115,ICD-167
Nanoscale Fault Isolation Technique by Conducting Atomic Force Microscopy

H. Maeda,  Y. Imai,  T. Koyama,  K. Fukumoto,  Y. Mashiko,  

[Date]2001/12/13
[Paper #]CPM-116,ICD-168
Electric characteristics evaluation of LSI devices by using Scanning Probe Microscope

Kazuaki KONDO,  Seigen OTANI,  Chikako YOSHIDA,  

[Date]2001/12/13
[Paper #]CPM-117,ICD-169
Failure analysis technique by extracting the TEM samples from the backside of LSI chips

H. Maeda,  M. Furuta,  M. Hashikawa,  Y. Hirose,  K. Fukumoto,  Y. Mashiko,  

[Date]2001/12/13
[Paper #]CPM-118,ICD-170
An Efficient Power-Supply Regulator for Ultra Low Power Wireless Applications

Kotaro Higuchi,  Kenichi Nakashi,  Yukinori Kuroki,  

[Date]2001/12/13
[Paper #]CPM-119,ICD-171
ITC coding processor with GA : A proposal of architecture(1)

Takeshi FURUKAWA,  Tomo ISHIKAWA,  Arata MIYAUCHI,  

[Date]2001/12/13
[Paper #]CPM-120,ICD-172
Thermal Design of the 3D Die-stacked Module

Yasuhiro YAMAJI,  Tatsuya ANDO,  Tadahiro MORIFUJI,  Tomotoshi SATO,  Kenji TAKAHASHI,  

[Date]2001/12/13
[Paper #]CPM-121,ICD-173
[OTHERS]

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[Date]2001/12/13
[Paper #]