Electronics-Electromechanical Devices(Date:2007/05/11)

Presentation
表紙

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[Date]2007/5/11
[Paper #]
目次

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[Date]2007/5/11
[Paper #]
Measuring Mechanical Properties of Sn Plating Using Indentation

Daisuke MACHIHARA,  

[Date]2007/5/11
[Paper #]EMD2007-6
Analysis of electric contact make/break operation of bending structure including effects of Coulomb's electrostatic force

Noboru WAKATSUKI,  Takanori KIKUCHI,  Hiroshi HONMA,  Nobuo TAKATSU,  

[Date]2007/5/11
[Paper #]EMD2007-7
Mechanical displacement measurement of bouncing contact electrode in an electromagnetic relay

Hiroshi HONMA,  Takumi SUZUKI,  Noboru WAKATSUKI,  

[Date]2007/5/11
[Paper #]EMD2007-8
Development of New Molded Interconnect Device : Innovative MID technology to realize a micro device

Mitsuru KOBAYASHI,  

[Date]2007/5/11
[Paper #]EMD2007-9
A Nondestructive PIM Evaluation of Electrical Contacts using Antenna Near-Field

Nobuhiro KUGA,  Atsunori ENDO,  

[Date]2007/5/11
[Paper #]EMD2007-10
3-D Dynamic Graphic Vibration Pttern of Printed Circuit Board by Using Holography

Hiromichi KUBOTA,  Masanari TANIGUCHI,  Shosuke SUZUKI,  Tasuku TAKAGI,  

[Date]2007/5/11
[Paper #]EMD2007-11
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[Date]2007/5/11
[Paper #]
奥付

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[Date]2007/5/11
[Paper #]