Electronics-Electromechanical Devices(Date:1997/09/19)

Presentation
表紙

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[Date]1997/9/19
[Paper #]
目次

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[Date]1997/9/19
[Paper #]
Study of Deposition Processes with Silica-based PLC Chip

H. Tanaka,  K. Nakasendou,  H. Matsumoto,  F. Matsumura,  Y. Fujii,  

[Date]1997/9/19
[Paper #]EMD97-55
Extended Bookshelf Packaging system using high-speed front interconnection

Katsumi Kaizu,  Sinji Koike,  Tohru Kishimoto,  

[Date]1997/9/19
[Paper #]EMD97-56
Diamond in electronic materials : Its thermal property and electrical characteristic

Katsuji Haruna,  

[Date]1997/9/19
[Paper #]EMD97-57
SMT (Surface Mountable) Optical Module for Subscriber Network

Kenji Yamauchi,  Kazuhiko Kurata,  Mitsuru Kurihara,  Yoshiki Sano,  Satoshi Dohmae,  

[Date]1997/9/19
[Paper #]EMD97-58
Surface Analysis by TOF-SIMS

Shigeyuki Mori,  

[Date]1997/9/19
[Paper #]EMD97-59
[OTHERS]

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[Date]1997/9/19
[Paper #]