IEICE Technical Committee

Electronics-Electromechanical Devices(Date:1995/12/15)

Presentation

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[Date]1995/12/15
[Paper #]

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[Date]1995/12/15
[Paper #]

Thermal Deformation Analysis of Printed Circuit Board and Connector Due to Current Flow by Using Holographic Pattern Measuring System (HPMS)

Masanari TANIGUCHI, Tasuku TAKAGI,

[Date]1995/12/15
[Paper #]EMD95-51

Commutation and breaking arc in dielectric liquids

Kazuo Bekki, Taro Yamamoto, Koichiro Sawa,

[Date]1995/12/15
[Paper #]EMD95-52

Transition from Metallic to Gaseous Phase in Ag Alloy Break Arc (Part 1)

Kiyoshi YOSHIDA, Atsuo TAKAHASHI,

[Date]1995/12/15
[Paper #]EMD95-53

Distribution of Metallic Phase Arc Duration at the Interruption of Small Current by Opening Contact

Keiichi Suhara,

[Date]1995/12/15
[Paper #]EMD95-54

The Investigation of Ag Contact Surface Morphology in Breaking Arcs

Zhuan-Ke Chen, Koichiro Sawa,

[Date]1995/12/15
[Paper #]EMD95-55

Evaluation for Signal Transmission Capability of Interconnection between Packages using Through-type Connector

Masato Nakamura, Nobuaki Sugiura, Katsumi Kaizu, Kei-ichi Yasuda,

[Date]1995/12/15
[Paper #]EMD95-56

Correlation between adhesive force and the number of sliding operations on gold electrical contacts

Atsuto KOBAYASHI, Satoshi TAKANO, Takayoshi KUBONO,

[Date]1995/12/15
[Paper #]EMD95-57

New system for the life Reliability Test Method of Connector

Kunio MANO,

[Date]1995/12/15
[Paper #]EMD95-58

Systematization for Electric Contact Engineering(1)

Kunio MANO,

[Date]1995/12/15
[Paper #]EMD95-59

Fretting Apparatus and Fretting Experiment on Water Soluble Lubricant

Chun-Bo Shao, Ji-Gao Zhang, Kimio Sugimura,

[Date]1995/12/15
[Paper #]EMD95-60

Past Developmental Reports and Future Problems for Electromagnetic Relays

Kunio MANO,

[Date]1995/12/15
[Paper #]EMD95-61

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[Date]1995/12/15
[Paper #]