Electronics-Component Parts and Materials(Date:2000/11/30)

Presentation
表紙

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[Date]2000/11/30
[Paper #]
目次

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[Date]2000/11/30
[Paper #]
A measurement and simulation study of transmission lines on microstrip and stacked-pair structure for high speed signals

Yasuhiko ODATE,  Kanji OTSUKA,  Tamotsu USAMI,  Tadatomo SUGA,  

[Date]2000/11/30
[Paper #]CPM2000-135,ICD2000-168
Sn-Ag Solder Bump Process

Hirokazu Ezawa,  Masahiro Miyata,  

[Date]2000/11/30
[Paper #]CPM2000-136,ICD2000-169
The Effect of Solder Pad Metallization on Solder Fatigue Iife and Crack Growth Life

Masazumi Amagai,  

[Date]2000/11/30
[Paper #]CPM2000-137,ICD2000-170
Silicon Interposer Technology for High-density Package

Mie Matsuo,  Nobuo Hayasaka,  Katsuya Okumura,  Chiaki Takubo,  Eiichi Hosomi,  

[Date]2000/11/30
[Paper #]CPM2000-138,ICD2000-171
A New 3-D Packaging Technology Utilizing Jet Printing System

Takanari SASAYA,  Shinichiro KAWAKITA,  Kazuhiro TURUTA,  Nobuaki KAWAHARA,  

[Date]2000/11/30
[Paper #]CPM2000-139,ICD2000-172
Evaluation of the DRAM manufacturing process with wafer-level-CSP technology through simulation analysis

M. Tanabe,  K. Nakamae,  H. Fujioka,  

[Date]2000/11/30
[Paper #]CPM2000-140,ICD2000-173
[OTHERS]

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[Date]2000/11/30
[Paper #]