Electronics-Component Parts and Materials(Date:1999/12/03)

Presentation
表紙

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[Date]1999/12/3
[Paper #]
目次

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[Date]1999/12/3
[Paper #]
[CATALOG]

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[Date]1999/12/3
[Paper #]
A Monolithic Microwave Integrated Circuit Doubler using a Resonant-Tunneling High Electron Mobility Transistor

Munenari Kawashima,  Hitoshi Hayashi,  Hiroshi Okazaki,  Hiroyuki Fukuyama,  Hideaki Matsuzaki,  Masahiro Muraguchi,  

[Date]1999/12/3
[Paper #]CPM99-128
High-Reliable Probe Card for Wafer Testing.

M. Takemoto,  S. Maekawa,  Y. Kashiba,  Y. Deguchi,  K. Miki,  T. Nagata,  

[Date]1999/12/3
[Paper #]CPM99-129
Optima: 640Gb/s High-speed ATM Switching system based on 0.25μm CMOS, MCMC-C, and Optical WDM Interconnection

Kimihiro YAMAKOSHI,  Naoaki YAMANAKA,  Ryusuke KAWANO,  Eiji OKI,  Seisho YASUKAWA,  Katsuhiko OKAZAKI,  

[Date]1999/12/3
[Paper #]CPM99-130
LCP film for high frequency printed circuit board It's application and characterization

Toshiaki Sato,  Tatsuya Sunamoto,  Yoshinobu Tanaka,  

[Date]1999/12/3
[Paper #]CPM99-131
The Technology Overview and the Future Development of Wafer Level Packages

Sei-ich Denda,  

[Date]1999/12/3
[Paper #]CPM99-132
Advantage of silver plating on PCB for CSP/BGA assembly : Improvement of connection reliability for special kind of silver plating on PCB.

Satoru Saito,  John Baker,  

[Date]1999/12/3
[Paper #]CPM99-133
Reduced Parastic Inductances in BGA Package using Floating Conductive Plane

Tsuyoshi Ishihara,  Tomo Yasuda,  Hidetoshi Murakami,  Masahiko Kobayashi,  Toyohiko Kumakura,  

[Date]1999/12/3
[Paper #]CPM99-134
The Chip Size Package for High Speed Digital Interface

Yoshiyuki SAITO,  Osamu SHIBATA,  Yukihiro FUKUMOTO,  Tetsuyoshi OGURA,  Yutaka TAGUCHI,  

[Date]1999/12/3
[Paper #]CPM99-135
Advanced three-dimensional packaging technology for high-density CCD micro-camera system module

Hiroshi YAMADA,  Takashi TOGASAKI,  Takashi TERUI,  Masanobu KIMURA,  Kazushige OOI,  Hajime SUDO,  

[Date]1999/12/3
[Paper #]CPM99-136
Flip Chip Bonding Techniques Using Transferred Microsolder Bumps for Optical Modules

Nobutatsu Koshoubu,  Suzuko Ishizawa,  Hideki Tsunetsugu,  Hideyuki Takahara,  

[Date]1999/12/3
[Paper #]CPM99-137
[OTHERS]

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[Date]1999/12/3
[Paper #]