Electronics-Component Parts and Materials(Date:1996/12/13)

Presentation
表紙

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[Date]1996/12/13
[Paper #]
目次

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[Date]1996/12/13
[Paper #]
Development of Tape BGA Type CSP

Ichirou Anjoh,  Ryo Haruta,  Takanori Hasizume,  Junichi Saeki,  Akira Nagai,  Makoto Kitano,  

[Date]1996/12/13
[Paper #]CPM96-121
Structure and Characteristics of BCC

Hideharu SAKODA,  Kazuto TSUJI,  Seiichi ORIMO,  Ryuji NOMOTO,  Masanori ONODERA,  Yoshiyuki YONEDA,  Junichi KASAI,  

[Date]1996/12/13
[Paper #]CPM96-122
RELLBILITY OF FLIP CHIP PACKAGE DURING REFLOW SOLDERING

Yumiko Ohshima,  Takahito Nakazawa,  Kazuhide Doi,  Hideo Aoki,  Yoichi Hiruta,  

[Date]1996/12/13
[Paper #]CPM96-123
B GA Package : C-BGA Package using FIT printing technology

Hayami Matsunaga,  

[Date]1996/12/13
[Paper #]CPM96-124
ボール実装型スタックモジュールの開発

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[Date]1996/12/13
[Paper #]CPM96-125
CSP Mounting Technology

YOUSUKE YAMAMOTO,  

[Date]1996/12/13
[Paper #]CPM96-126
Small and High Performance Packaging Technology : Now and Future

Yoichi Hiruta,  

[Date]1996/12/13
[Paper #]CPM96-127
The State of Art and Problems of The Recent Packages : CSP,BGA,etc

Hiroshi Shibata,  Takanori Hashizume,  Hayami Matsunaga,  Yuusuke Yamamoto,  Youichi Hiruta,  Tomohiro Hashimoto,  

[Date]1996/12/13
[Paper #]CPM96-128
[OTHERS]

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[Date]1996/12/13
[Paper #]