Electronics-Component Parts and Materials(Date:1996/08/20)

Presentation
表紙

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[Date]1996/8/20
[Paper #]
目次

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[Date]1996/8/20
[Paper #]
Recent Progress in Optical Hybrid Integration using PLC Platform

Yasufumi Yamada,  Toshikazu Hashimoto,  Yuji Akahori,  Hiroshi Takahashi,  Naoto Uchida,  Yoshio Itaya,  Kazuyuki Moriwaki,  

[Date]1996/8/20
[Paper #]EDM-96-24,CPM-96-47,OPE-96-46,LQE-96-48
Adhesive Sealing Technologies for LD Module Using Si Platform

Kazunori MIURA,  Seimi SASAKI,  Kazuhiro TANAKA,  Mitsuhiro YANO,  

[Date]1996/8/20
[Paper #]EDM-96-25,CPM-96-48,OPE-96-47,LQE-96-49
Coupling between stacked waveguides using grating couplers

Q. Xing,  S. Ura,  T. Suhara,  H. Nishihara,  

[Date]1996/8/20
[Paper #]EDM-96-26,CPM-96-49,OPE-96-48,LQE-96-50
Beam-expander integrated 1.3-μm ridge waveguide semiconductor laser for low-cost packaging

H. Sato,  M. Aoki,  M. Komori,  M. Suzuki,  M. Takahashi,  Y. Yasuda,  K. Uomi,  S. Tsuji,  

[Date]1996/8/20
[Paper #]EDM-96-27,CPM-96-50,OPE-96-49,LQE-96-51
Self-Aligning Optical Coupling Scheme Using Optical Microconnector

Toshio Kato,  Jun Rogerio Mizuno,  Kenichi Iga,  

[Date]1996/8/20
[Paper #]EDM-96-28,CPM-96-51,OPE-96-50,LQE-96-52
High-speed directional coupler waveguide switch modules integrated with spotsize converters

S. Sekine,  K. Kawano,  N. Yoshimoto,  M. Kohtoku,  H. Takeuchi,  M. Wada,  T. Ito,  M. Yanagibashi,  S. Kondo,  Y. Noguchi,  M. Naganuma,  

[Date]1996/8/20
[Paper #]EDM-96-29,CPM-96-52,OPE-96-51,LQE-96-53
Alignment-free packaging for optical modules using AuSn solder bump self-aligned assembly

Jun'ichi SASAKI,  Isao YONEDA,  Masataka ITOH,  Hiroshi HONMOU,  Akihiro UDA,  Toshitaka TORIKAI,  

[Date]1996/8/20
[Paper #]EDM-96-30,CPM-96-53,OPE-96-52,LQE-96-54
Structural Dependence of Coupling Tolerance for Waveguide Photodiodes

K. Nishikata,  K. Hiraiwa,  H. Shimizu,  N. Iwai,  N. Yamanaka,  A. Kasukawa,  

[Date]1996/8/20
[Paper #]EDM-96-31,CPM-96-54,OPE-96-53,LQE-96-55
optical module with MU connector interface using self-alignment technique by solder-bump chip bonding

Tsuyoshi Hayashi,  Hideki Tsunetsugu,  

[Date]1996/8/20
[Paper #]EDM-96-32,CPM-96-55,OPE-96-54,LQE-96-56
WDM Optical Receiver Module with Fiber Embedded Circuit

Tomoaki Uno,  Genji Tohmon,  Takayuki Yoshida,  Tohru Nishikawa,  Yasushi Matsui,  

[Date]1996/8/20
[Paper #]EDM-96-33,CPM-96-56,OPE-96-55,LQE-96-57
A Unified Software for Stress/Strain Induced Optical Waveguide Devices

Kimihiro OHKUBO,  Masanori KOSHIBA,  Yasuhide TSUJI,  

[Date]1996/8/20
[Paper #]EDM-96-34,CPM-96-57,OPE-96-56,LQE-96-58
Polymer Flexible Waveguides

A. Kaneko,  M. Hikita,  M. Kihara,  S. Imamura,  

[Date]1996/8/20
[Paper #]EDM-96-35,CPM-96-58,OPE-96-57,LQE-96-59
Developmenit of Silica-based PLC Coupler by TEOS Low Temperature Plasma CVD

F. Matsumura,  H. Matumoto,  K. Nakasendou,  H. Tanaka,  Y. Fujii,  

[Date]1996/8/20
[Paper #]EDM-96-36,CPM-96-59,OPE-96-58,LQE-96-60
High Reliable Long Life Cooling Fan for Communication Equipment

Yasuo Kaneko,  Akio Harada,  Osamu Ibaraki,  

[Date]1996/8/20
[Paper #]EDM-96-37,CPM-96-60,OPE-96-59,LQE-96-61
High-speed signal transmission at the front of a bookshelf packaging system

Shinji Koike,  Katsumi Kaizu,  

[Date]1996/8/20
[Paper #]EDM-96-38,CPM-96-61,OPE-96-60,LQE-96-62
[OTHERS]

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[Date]1996/8/20
[Paper #]