Electronics-Component Parts and Materials(Date:1994/10/21)

Presentation
表紙

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[Date]1994/10/21
[Paper #]
目次

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[Date]1994/10/21
[Paper #]
A study on the thermal stability of Ta_2N anodized thin film capacitors prepared at low anodization voltage

Misao Yamane,  Katsutaka Sasaki,  Yoshio Abe,  Atsushi Noya,  

[Date]1994/10/21
[Paper #]CPM94-71
Development of via formation technique in copper-polymide substrate

Mitsumasa Mori,  Teruhito Matsui,  Osamu Hayashi,  Masanobu Kohara,  

[Date]1994/10/21
[Paper #]CPM94-72
Development of via formation technique in copper-polymide substrate

Tsutomu Yokobori,  Naoharu Horino,  

[Date]1994/10/21
[Paper #]CPM94-73
Power supply construction for book-shelf packaging systems using bus bars and power supply connectors.

Katsumi Kaizu,  Tohru Kishimoto,  

[Date]1994/10/21
[Paper #]CPM94-74
[OTHERS]

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[Date]1994/10/21
[Paper #]