Electronics-Component Parts and Materials(Date:1994/05/19)

Presentation
表紙

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[Date]1994/5/19
[Paper #]
目次

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[Date]1994/5/19
[Paper #]
Auger electron spectroscopy study on the thermal stability of Cu/ Ta_2Al/Ta/Si contact structure

Akira Ohta,  Atsushi Noya,  Mayumi Takeyama,  Katsutaka Sasaki,  Masahiro Taguchi,  

[Date]1994/5/19
[Paper #]CPM94-1
Total reflection X-ray fluorescence analysis for ultratrace surface contamination

Kunihiro Miyazaki,  Ayako Shimazaki,  

[Date]1994/5/19
[Paper #]CPM94-2
X-ray fluorescence analysis using high energy X-rays. -X-rya fluorescence analysisi for heavy atoms using W-shite X-ray exited by highly applied voltage.

Takahashi Y,  Yamamoto K,  Ohsima K,  P.Okamura F,  

[Date]1994/5/19
[Paper #]CPM94-3
Misorientation of Al-Si-Cu layers for VLSI interconnection from Al(111) plane

Tomohisa Okuda,  Kiyotaka Shinada,  Tohru Hara,  Yukihiro Kino,  Takahisa Satoh,  Toshihiko Hori,  Shozo Ngano,  Tadao Ueda,  

[Date]1994/5/19
[Paper #]CPM94-4
Comments on New Substrate Materials Suitable for Epitaxial Growth of Superconducting Oxide Films

Tadataka Morishita,  Akira Oishi,  

[Date]1994/5/19
[Paper #]CPM94-5
Fabrication of New-Type Semiconductors Development of New Ion Beam Technology:Combined Ion Beam and Molecular Beam Epitaxy(CIBMBE) Method

Yunosuke Makita,  Hajime Shibata,  Akimasa Yamada,  

[Date]1994/5/19
[Paper #]CPM94-6
Electron Distribution Analysis of C(diamond),Si,Ge,Fe_3O_4 etc. Using Uotra-short Wavelength X-rays

P.Okamura F,  Yukino K,  Yamamoto K,  Ohshima K,  Kino Y,  

[Date]1994/5/19
[Paper #]CPM94-7
[OTHERS]

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[Date]1994/5/19
[Paper #]