Electronics-Electromechanical Devices(Date:2009/01/16)

Presentation
表紙

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[Date]2009/1/16
[Paper #]
目次

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[Date]2009/1/16
[Paper #]
High Density Optical Interconnection Technologies for Large Capacity Information Processing Equipments

Yasunobu MATSUOKA,  Takuma BAN,  Reiko MITA,  Toshiki SUGAWARA,  

[Date]2009/1/16
[Paper #]EMD2008-113
High Density Multi-Fiber Connector for Optical Interconnection

Naoya NISHIMURA,  Katsuki SUEMATSU,  Masao SHINODA,  Masato SHIINO,  

[Date]2009/1/16
[Paper #]EMD2008-114
16-fiber Type SF connector for on-board optical wiring

Ryo NAGASE,  Shuichiro ASAKAWA,  Masaru KOBAYASHI,  Yoshiteru ABE,  

[Date]2009/1/16
[Paper #]EMD2008-115
Degradation phenomenon of electrical contacts by hammering oscillating mechanism : for Contact Resistance (III)

Shin-ichi WADA,  Taketo SONODA,  Keiji KOSHIDA,  Mitsuo KIKUCHI,  Hiroaki KUBOTA,  Koichiro SAWA,  

[Date]2009/1/16
[Paper #]EMD2008-116
Synthesis of electroconductive diamond film for application as electrical contact

Toshiki TSUBOTA,  Tomoo HAMAYAMA,  Naoya MURAKAMI,  Teruhisa OHNO,  Tomoko Suenaga,  Hiroyuki NAGAHATA,  

[Date]2009/1/16
[Paper #]EMD2008-117
A Study of Solder Connection Reliability in Cooling Design for Outdoor Telecommunications Equipment

Nobuhiro TAMAYAMA,  Shinya HAMAGISHI,  Seiji ASAI,  Takeshi TAJIRI,  Osamu KAMIMURA,  

[Date]2009/1/16
[Paper #]EMD2008-118
Manufacturing Technology for Embedded LSI(WLP) Substrates

Keisuke OKADA,  

[Date]2009/1/16
[Paper #]EMD2008-119
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[Date]2009/1/16
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[Date]2009/1/16
[Paper #]
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[Date]2009/1/16
[Paper #]