IEICE Electronics Express

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ONLINE ISSN:1349-2543

J-tagemark

Review Papers
3-D integration technologies (Apr. 2015)

Integrated circuits

Vol.12 No.7 20152001 : REVIEW PAPER

Recent progress in 3D integration technology

Mitsumasa Koyanagi

 

Electron devices, circuits, and systems

Vol.12 No.7 20152002 : REVIEW PAPER

Review of wafer-level three-dimensional integration (3DI) using bumpless interconnects for tera-scale generation

Takayuki Ohba, Youngsuk Kim, Yoriko Mizushima, Nobuhide Maeda, Koji Fujimoto, Shoichi Kodama