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Technical Committee on Silicon Device and Materials (SDM)  (2019)

Chair: Hiroshige Hirano (TowerPartners Semiconductor) Vice Chair: Shunichiro Ohmi (Tokyo Inst. of Tech.)
Secretary: Takahiro Mori (AIST), Nobuaki Kobayashi (Nihon Univ.)
Assistant: Taiji Noda (Panasonic), Tomoyuki Suwa (Tohoku Univ.)

Search Results: Keywords 'from:2020-02-07 to:2020-02-07'

[Go to Official SDM Homepage (Japanese)] 
Search Results: Conference Papers
 Conference Papers (Available on Advance Programs)  (Sort by: Date Ascending)
 Results 1 - 10 of 10  /   
Committee Date Time Place Paper Title / Authors Abstract Paper #
SDM 2020-02-07
09:20
Tokyo Tokyo University-Hongo Formation of passivation layer on Cu and Co surfaces in BTA-H2O2 aqueous solutions
Kondoh, Eiichi, Toyama, Mao, Takeuchi, Shota, Jin, Lianhua (Univ. Yamanashi), Ryota Koshino, Hamada, Satomi, Shima, Shohei, Hiyama, Hirokuni (Ebara Corp.) SDM2019-88
 [more] SDM2019-88
pp.1-3
SDM 2020-02-07
09:35
Tokyo Tokyo University-Hongo [Invited Talk] Impact of Homogeneously Dispersed Al Nanoclusters by Si-monolayer Insertion into Hf0.5Zr0.5O2 Film on FeFET Memory Array with Tight Threshold Voltage Distribution
Tadashi Yamaguchi, Keiichi Maekawa, Takahiro Ohara, Atsushi Amo, Eiji Tsukuda, Kenichiro Sonoda, Hiroshi Yanagita, Masao Inoue, Masazumi Matsuura, Tomohiro Yamashita (Renesas) SDM2019-89
 [more] SDM2019-89
pp.5-8
SDM 2020-02-07
10:10
Tokyo Tokyo University-Hongo [Invited Talk] Stability of Cu Interconnect Surface after post CMP Cleaning
Yasuhiro Kawase, Toshiaki Shibata, Tomohiro Kusano (MCC), Ken Harada (imec), Kan Takeshita (MCC) SDM2019-90
At present, more than 12 Cu interconnect layers have been formed in advanced semiconductor devices and each layer is pla... [more] SDM2019-90
pp.9-14
SDM 2020-02-07
10:45
Tokyo Tokyo University-Hongo [Invited Talk] Role of electroless-Ni plating in high-aspect-ratio TSV fabrication for 3D integration and packaging
Murugesan Mariappan, Takafumi Fukushima (Tohoku Univ.) SDM2019-91
 [more] SDM2019-91
pp.15-19
SDM 2020-02-07
11:20
Tokyo Tokyo University-Hongo [Invited Talk] Novel Volatile Film for Precise Dual Damascene Fabrication
Makoto Fujikawa, Tatsuya Yamaguchi (TTS), Yuki Kikuchi, Kaoru Maekawa (TTCA), Hiroaki Kawasaki, Yoji Iizuka (TEL) SDM2019-92
Abstract— Plasma induced damage on porous low-k dielectrics is a critical issue to lower the interconnect RC delay in th... [more] SDM2019-92
pp.21-23
SDM 2020-02-07
13:30
Tokyo Tokyo University-Hongo [Special Invited Talk] Possibility of intermetallic compounds for ultra-small scale interconnections
Junichi Koike, Linghan Chen (Tohoku Univ), Shinji Yokogawa (Univ. Elec-Comm) SDM2019-93
 [more] SDM2019-93
p.25
SDM 2020-02-07
14:20
Tokyo Tokyo University-Hongo [Invited Talk] Solution-processed interconnections using vacuum ultraviolet
Takeo Minari, Wanli Li, Qingqing Sun, Lingying Li (NIMS), Xuying Liu (Zhengzhou Univ.), Masayuki Kanehara (C-INK) SDM2019-94
We propose new metallization methods based on "surface selective deposition" or "selective electroless plating". [more] SDM2019-94
pp.27-30
SDM 2020-02-07
14:55
Tokyo Tokyo University-Hongo [Invited Talk] A THIN BONDING MATERIAL FOR HIGH DENSITY HETEROGENEOUS INTEGRATION
Yasuhisa Kayaba, Yuzo Nakamura, Jun Kamada, Takashi Kozeki, Kazuo Kohmura (MCI) SDM2019-95
A new thin bonding material was developed for the heterogeneous device chip integration by Cu-Cu hybrid bonding. The bon... [more] SDM2019-95
pp.31-34
SDM 2020-02-07
15:50
Tokyo Tokyo University-Hongo [Invited Talk] Thermal Boundary Resistance of Metal/Dielectric Interfaces in Silicon Nanowire Thermoelectric Generators
Tianzhuo Zhan (Waseda Univ.) SDM2019-96
 [more] SDM2019-96
pp.35-38
SDM 2020-02-07
16:25
Tokyo Tokyo University-Hongo [Invited Talk] Nanophotonics contributions to state-of-the-art CMOS Image Sensors
Sozo Yokogawa (SSS) SDM2019-97
Recent progress of Back-illuminated CMOS image sensor (BI-CIS), focusing on their pixel improvements with design of opti... [more] SDM2019-97
pp.39-43
 Results 1 - 10 of 10  /   
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