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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
 Results 1 - 14 of 14  /   
Committee Date Time Place Paper Title / Authors Abstract Paper #
LQE, OPE, CPM, EMD, R 2023-08-25
10:00
Miyagi Tohoku university
(Primary: On-site, Secondary: Online)
[Invited Talk] Status and Prospects of the Integrated Photonics Ecosystem
Tsuyoshi Horikawa (Tokyo Tech) R2023-29 EMD2023-24 CPM2023-34 OPE2023-73 LQE2023-20
The current status and future evolution of the business ecosystem that supports the development of integrated photonics ... [more] R2023-29 EMD2023-24 CPM2023-34 OPE2023-73 LQE2023-20
pp.63-66
HWS, VLD 2023-03-04
14:20
Okinawa
(Primary: On-site, Secondary: Online)
Side-channel Information Leakage Resistance Evaluation of Cryptographic Multi- chip Modules
Takumi Matsumaru, Kazuki Monta (Kobe Univ.), Takaaki Okidono (SCU), Takuzi Miki, Makoto Nagata (Kobe Univ.) VLD2022-122 HWS2022-93
Demand for multi-chip packaging technology is rising. This study focuses on two types of packaging technologies in parti... [more] VLD2022-122 HWS2022-93
pp.273-278
SDM 2023-02-07
14:40
Tokyo Tokyo Univ.
(Primary: On-site, Secondary: Online)
[Invited Talk] New Approach for Epoxy Mold Compound Slurry in Advanced Packaging Technology
Shogo Arata, Chiaki Noda, Yasuhiro Ichige, Satoyuki Nomura (Resonac), Trianggono Widodo, Nagatoshi Tsunoda, Xavier Brun (Intel) SDM2022-90
Chemical mechanical polishing (CMP) process has been a part of semiconductor manufacturing processes from front-end to b... [more] SDM2022-90
pp.23-26
VLD, DC, RECONF, ICD, IPSJ-SLDM [detail] 2022-11-29
14:40
Kumamoto  
(Primary: On-site, Secondary: Online)
Evaluating system level security of cryptography module
Takumi Matsumaru, Kazuki Monta (Kobe Univ.), Takaaki Okidono (SCU), Takuji Miki, Makoto Nagata (Kobe Univ.) VLD2022-32 ICD2022-49 DC2022-48 RECONF2022-55
Packaging technology is a technique used to encapsulate semiconductor chips in a frame, and has been attracting attentio... [more] VLD2022-32 ICD2022-49 DC2022-48 RECONF2022-55
pp.78-81
OPE, LQE, OCS 2022-05-13
16:55
Online Online [Special Invited Talk] GI-Core Multimode and Single-Mode Polymer Waveguides for High-Density Co-Packaging
Takaaki Ishigure (Keio Univ.) OCS2022-9 OPE2022-9 LQE2022-9
Glowing interests has been focused on the co-packaging optics technology in which a high-speed optical transceiver compo... [more] OCS2022-9 OPE2022-9 LQE2022-9
pp.34-39
SDM 2021-02-05
15:20
Online Online [Invited Talk] AI for material, material for AI
Shintaro Yamamichi (IBM Japan) SDM2020-59
Future of Computing realized by Hybrid Cloud integrating three calculation elements, bits, neurons and qubits, is introd... [more] SDM2020-59
pp.19-22
MW 2019-12-19
15:05
Gifu Gifu Unif. Satellite Campus [Special Talk] 3-D Radiation Pattern Measurement of 60-GHz-Band Phased Array Antenna Using 4x2 Patch Array Antenna
Ryutaro Onimaru, Satoshi Yoshida, Kenjiro Nishikawa (Kagoshima Univ.) MW2019-124
In this paper, we report a designed ,fabricated, and measured results of a 60-GHz-band 2×2 beam-
forming arrray antenna... [more]
MW2019-124
pp.31-36
MW, AP
(Joint)
2019-09-20
16:00
Kanagawa JAXA (Sagamihara) Experimental Verification of Copper Ball Interconnection and 3-D Antenna Pattern Measurement Techniques Using 60-GHz-Band Patch Arrray Antenna
Satoshi Yoshida, Ryutaro Onimaru, Kenjiro Nishikawa (Kagoshima Univ.) MW2019-63
In this paper, we report a designed ,fabricated, and measured results of a 60-GHz-band 2×2 beamform-
ing arrray antenna... [more]
MW2019-63
pp.43-47
LQE, OPE, EMD, R, CPM 2016-08-25
09:45
Hokkaido   Packaging of 16ch (4chx4) Integrated Light Sources with Laser Diode Arrays on Silicon Substrate.
Motoyuki Nishizawa, Nobuaki Hatori, Yu Tanaka, Mitsuru Kurihara, Kazuhiko Kurata (PETRA) R2016-20 EMD2016-24 CPM2016-33 OPE2016-54 LQE2016-29
We are developing packaging technology of hybrid integrated light sources on Silicon platform for realization high capac... [more] R2016-20 EMD2016-24 CPM2016-33 OPE2016-54 LQE2016-29
pp.5-8
EMD, LQE, OPE, CPM, R 2014-08-22
14:25
Hokkaido Otaru Economy Center Opto-electronic hybrid integrated chip packaging technology for silicon photonic platform using gold-stud bump bonding
Mitsuo Usui, Kotaro Takeda, Hirooki Hirata, Hiroshi Fukuda, Tai Tsuchizawa, Hidetaka Nishi, Rai Kou, Tatsuro Hiraki, Kentaro Honda, Masafumi Nogawa, Koji Yamada, Tsuyoshi Yamamoto (NTT) R2014-45 EMD2014-50 CPM2014-65 OPE2014-75 LQE2014-49
We propose a new solder-free and low-temperature (200 ℃ or less) flip-chip integration technology for silicon photonic p... [more] R2014-45 EMD2014-50 CPM2014-65 OPE2014-75 LQE2014-49
pp.109-114
MWP, OPE, MW, EMT, EST, IEE-EMT [detail] 2012-07-27
10:30
Hokkaido Hokkaido Univ. A MEMS mirror array for wavelength selective switches with a structure to suppress electrical interference between adjacent channels
Mitsuo Usui, Shingo Uchiyama, Etsu Hashimoto, Tomomi Sakata, Nobuhiro Shimoyama, Koichi Hadama, Nobuaki Matsuura, Yuzo Ishii, Tohru Matsuura (NTT) MW2012-48 OPE2012-41 EST2012-30 MWP2012-29
We developed a new two-axis microelectromechanical systems (MEMS) mirror array for wavelength selective switches. This M... [more] MW2012-48 OPE2012-41 EST2012-30 MWP2012-29
pp.137-142
SDM, ED
(Workshop)
2012-06-27
09:30
Okinawa Okinawa Seinen-kaikan [Keynote Address] More-than-Moore Devices based on Advanced CMOS Technologies
Hitoshi Wakabayashi (Sony)
Based on the discussion on advanced CMOS device technologies using benchmark data, more-than-Moore devices are introduce... [more]
MW 2009-11-20
11:20
Kagoshima Tanegashima Development of millimeter wave surface mount package capable of measurement with or without printed circuit boards for secondary packaging
Takashi Shimizu (Utsunomiya Univ.), Hiroshi Nakano (Ammsys/Tokyo Inst. of Tech), Yoshinori Kogami (Utsunomiya Univ.), Yasutake Hirachi (Ammsys/Tokyo Inst. of Tech) MW2009-140
Generally, it is difficult to measure frequency responses of commercial based surface mount packages (PKG) which mounted... [more] MW2009-140
pp.69-74
OPE, CPM, R 2009-04-17
16:00
Tokyo Kikai-Shinko-Kaikan Bldg. MEMS Mirror Array Module for Wavelength Selective Switches (WSS)
Mitsuo Usui, Shingo Uchiyama, Etsu Hashimoto, Koichi Hadama, Yuzo Ishii, Nobuaki Matsuura, Tomomi Sakata, Nobuhiro Shimoyama, Tohru Matsuura, Fusao Shimokawa (NTT Corp.) R2009-7 CPM2009-7 OPE2009-7
We developed a new two-axis microelectromechanical-systems (MEMS) mirror array module for wavelength selective switches ... [more] R2009-7 CPM2009-7 OPE2009-7
pp.35-39
 Results 1 - 14 of 14  /   
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