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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
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Committee Date Time Place Paper Title / Authors Abstract Paper #
EMCJ, IEE-EMC, IEE-MAG 2018-11-22
15:10
Overseas KAIST [Poster Presentation] Design and Analysis of Receiver Channels of Glass Interposers for 5G Small Cell Front End Module -- - --
Gapyeol Park, Youngwoo Kim, Kyungjun Cho, Junyong Park, Kyungjune Son, Hyunwook Park (KAIST), Atom Watanabee, Pulugurtha Markondeya Raj, Venky Sundaram, Rao Tummala (Georgia Tech), Joungho Kim (KAIST) EMCJ2018-71
In this paper, we design and analyze receiver channels of a glass interposer for a 5G small cell front end module (FEM).... [more] EMCJ2018-71
p.45
SDM 2017-02-06
16:10
Tokyo Tokyo Univ. [Invited Talk] Direct Cu metallization on TGV Glass substrate using Wet Process.
Kotoku Inoue, Masatoshi Takayama, Tsubasa Fujimura, Shigeo Onitake (Koto) SDM2016-146
It is believed that conformal metallization or via filling on glass with the highly conductive thick Cu material is expe... [more] SDM2016-146
pp.41-44
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