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All Technical Committee Conferences (Searched in: All Years)
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Search Results: Conference Papers |
Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
VLD, CAS, MSS, SIP |
2016-06-17 15:10 |
Aomori |
Hirosaki Shiritsu Kanko-kan |
Clock Distribution Network with Multiple Source Buffers for Stacked Chips Nanako Niioka, Masashi Imai, Kaoru Furumi, Atsushi Kurokawa (Hirosaki Univ.) CAS2016-31 VLD2016-37 SIP2016-65 MSS2016-31 |
In this report, we present a method to reduce clock skew among stacked chips by a clock distribution network with multip... [more] |
CAS2016-31 VLD2016-37 SIP2016-65 MSS2016-31 pp.167-172 |
VLD, CAS, MSS, SIP |
2016-06-17 15:30 |
Aomori |
Hirosaki Shiritsu Kanko-kan |
Thermal Analysis in 3D ICs Kaoru Furumi, Masashi Imai, Nanako Niioka, Atsushi Kurokawa (Hirosaki Univ.) CAS2016-32 VLD2016-38 SIP2016-66 MSS2016-32 |
Three-dimensional integrated circuits (3D ICs) lead to higher power densities than 2D ICs because of the stacking of mul... [more] |
CAS2016-32 VLD2016-38 SIP2016-66 MSS2016-32 pp.173-178 |
EMCJ |
2004-10-01 11:20 |
Nara |
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Shielded via structures for high-speed printed circuit boards Taras Kushta, Kaoru Narita (NEC) |
Shielded via structures formed by signal and ground vias jointly are an important type of vertical transitions providing... [more] |
EMCJ2004-60 pp.29-34 |
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