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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
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Committee Date Time Place Paper Title / Authors Abstract Paper #
MW 2019-11-15
Okinawa Minami Daido Villa. Tamokuteki Koryu Center Study on complex permittivity measurements of thermoplastic resins for 3D printer using NRD guide
Takashi Shimizu, Takuma Konno, Yoshinori Kogami (Utsunomiya Univ.) MW2019-117
Complex permittivity measurement method of thermal plastic resin rod are studied using millimeter wave transmission char... [more] MW2019-117
OFT 2018-10-11
Miyagi Touhoku Univ. [Poster Presentation] Development of polishing machine using thermoplastic resin bond wheel for end face of optical connector
Yuichiro Tsuda, Yuki Kano, Kenta Nara, Hiroshi Matsuura (Tohoku Gakuin Univ.) OFT2018-17
(To be available after the conference date) [more] OFT2018-17
(Joint) [detail]
Okinawa Okinawa Prefectural Museum Low reflectance lens with nanostructure
Sho Yakabe, Takuro Watanabe, Takayuki Shimazu (SEI), Ryohei Hokari, Kazuma Kurihara (AIST) OFT2017-81 OPE2017-189
Plastic lenses are utilized for optical communication devices such as AOC (Active Optical Cable), optical transceivers a... [more] OFT2017-81 OPE2017-189
pp.67-70(OFT), pp.105-108(OPE)
Ishikawa   Reflowable thermoplastic optical lens module for 10Gbps transmission with 850nm VCSEL
Takayuki Shimazu, Michiko Harumoto, Tomomi Sano (SEI), Takuro Watanabe (NTD), Shohei Okabe, Koji Katayama (SFP), Satoshi Yamazaki, Shinya Nishikawa (SEI) OFT2015-4
The thermoplastic optical lens that made by conventional injection molding method is productivity and cost effective but... [more] OFT2015-4
OFT 2010-05-27
Hiroshima tomo-kouminkan High Density Thermoplastic Ferrule and Their Polishing Condition
Naoya Nishimura, Katsuki Suematsu, Koji Seo, Nobuhiro Nanri, Masato Shiino (Furukawa Electric) OFT2010-9
Optical interconnection systems are attracting attention in recent years. Therefore, there are some proposals of high de... [more] OFT2010-9
EMD 2007-05-18
Miyagi Ishinomaki Senshu University Development of New Molded Interconnect Device -- Innovative MID technology to realize a micro device --
Mitsuru Kobayashi (Matsushita Electric Works, Ltd.) EMD2007-9
We developed Microscopic Integrated Processing Technology ("MIPTEC" for short) which enabled flip-chip mounting on a mol... [more] EMD2007-9
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