IEICE Technical Committee Submission System
Conference Schedule
Online Proceedings
[Sign in]
Tech. Rep. Archives
    [Japanese] / [English] 
( Committee/Place/Topics  ) --Press->
 
( Paper Keywords:  /  Column:Title Auth. Affi. Abst. Keyword ) --Press->

All Technical Committee Conferences  (All Years)

Search Results: Conference Papers
 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
 Results 1 - 20 of 42  /  [Next]  
Committee Date Time Place Paper Title / Authors Abstract Paper #
SDM 2021-01-28
14:05
Online Online [Invited Talk] Secure 3D CMOS Chip Stacks with Backside Buried Metal Power Delivery Networks for Distributed Decoupling Capacitance
Kazuki Monta (Kobe Univ.) SDM2020-51
In semiconductor integrated circuits, power signal integrity(PSI) and electromagnetic compatibility caused by power supp... [more] SDM2020-51
pp.8-12
EST 2021-01-21
14:55
Online Online Simulation of Eye-diagram Based on Two-terminal-pair Network -- Eye-diagram Computation Using Technical Formula Computing System --
Takahiko Kano, Moritoshi Yasunaga (Univ. Tsukuba) EST2020-61
An eye-diagram is one of the methods for the evaluation of signal integrity. The eye-diagram is measured by dividing a s... [more] EST2020-61
pp.45-50
EMCJ, IEE-EMC, IEE-SPC 2020-12-11
09:55
Online Online Study of Electronically Switchable Planar Intersection/Non-Intersection Circuit by Microstrip Structure for RF Signal
Yu Inuzuka, Atsuhiro Nishikata, Kiyomichi Araki (Tokyo Tech) EMCJ2020-57
This paper proposes electronically switchable compact planar intersection/non-intersection circuit for RF signal by load... [more] EMCJ2020-57
pp.13-16
EMCJ, IEE-EMC, IEE-MAG 2018-11-22
15:10
Overseas KAIST [Poster Presentation] Signal Integrity Analysis for High-speed Memory Test Interface using Data Capture PCB
Hyesoo Kim, Kyungjun Cho, Seongguk Kim, Joungho Kim (KAIST) EMCJ2018-80
In this paper, in high-speed graphic memory test interface, the trade-off relationship for electrical characteristic of ... [more] EMCJ2018-80
p.63
EMCJ, IEE-EMC, IEE-MAG 2017-05-19
13:20
Overseas Nanyang Technological University [Invited Talk] 2.5D Method of Modeling and Simulation for Signal/Power Integrity of High Speed Electronics
En-Xiao Liu, Siping Gao, Hui Min Lee (A*STAR IHPC) EMCJ2017-19
Electromagnetic characteristics related to signal integrity (SI), power integrity (PI) and EMC has become an essential d... [more] EMCJ2017-19
p.67
EMCJ, IEE-EMC, IEE-MAG 2016-06-02
13:48
Overseas NTU, Taiwan [Poster Presentation] A Broadband Filter Design for Common-Mode Noise Rejection with Multilayer Mushroom Structure in Differential Transmission Line
Ding-Bing Lin, Yi-Chien Chen (NTUT) EMCJ2016-29
A new multi-layer mushroom structure to suppress common mode noise rejection in differential transmission line is propos... [more] EMCJ2016-29
p.33
EMCJ, IEE-EMC 2015-12-18
15:40
Aichi TOYOTA CENTRAL R&D LABS., INC. [Special Talk] RF IC Chip Level Low Noise Technology for Mobile Telecommunication System by Means of Magnetic Materials
Masahiro Yamaguchi (Tohoku Univ.) EMCJ2015-101
In order to improve signal transfer rate in an RF receiver circuit of a cellular phone handset, developments of high spe... [more] EMCJ2015-101
pp.69-74
EMCJ, WPT
(Joint)
2015-01-22
12:15
Okinawa Okinawaken Jichikaikan Co-Analysis for SI/PI Problems of Differential Line in Multi-Layer PCB
Yuki Kawamitsu, Yoshio Kami (UEC), Kimitoshi Murano (Tokai Univ.), Fengchao Xiao (UEC) EMCJ2014-87
Recently, the PCB with multi-layer substrate (Multi-layer PCB) is extensively used with the trend of small size and high... [more] EMCJ2014-87
pp.13-18
EMCJ, WPT
(Joint)
2014-01-30
14:30
Saga Saga Univ. Optimization of the inter-layer connection structure for the high-speed signal
Tsuyoshi Kobayashi, Kouji Shibuya (Mitsubishi Electric), Norio Takeuchi, Kenji Maeda (Mitsubishi Electric Engineering) EMCJ2013-115
For a miniaturization and advanced features of equipment, the high-density and quality PCB design is required.Through ho... [more] EMCJ2013-115
pp.23-26
EMCJ, IEE-EMC, MW, EST [detail] 2013-10-24
17:05
Miyagi Tohoku Univ. [Invited Talk] Magnetic material and IC chip level EMC
Masahiro Yamaguchi, Sho Muroga, Yasushi Endo (Tohoku Univ.), Makoto Nagata (Kobe Univ.), Satoshi Tanaka (Tohoku Univ.) EMCJ2013-76 MW2013-116 EST2013-68
A technological challenge of LTE(Long Term Evolution) class RFIC is to solve desensitization of receiver circuit caused ... [more] EMCJ2013-76 MW2013-116 EST2013-68
pp.87-92
EMCJ 2013-07-11
13:35
Tokyo Kikai-Shinko-Kaikan Bldg. A Study on Embedded F-SIR Type Transmission Line for Negative Group Delay Characteristics
Xiaofan Yang, Yoshiki Kayano (Akita Univ.), Hiroshi Inoue (The Open University of Japan- Akita Study Center) EMCJ2013-32
Negative group delay characteristics can be used to improve signal-integrity performance such as an equalizer for compen... [more] EMCJ2013-32
pp.27-32
ICD, ITE-IST 2013-07-05
17:15
Hokkaido San Refre Hakodate Equivalent circuit representation of silicon substrate coupling of active RF components
Naoya Azuma, Makoto Nagata (Kobe univ.) ICD2013-44
Substrate coupling of radio frequency (RF) active components is represented by equivalent circuits unifying a resistive ... [more] ICD2013-44
pp.125-128
EMCJ 2013-04-12
11:05
Okayama Okayama Univ. Redection in common-mode radiation and maintenance of signal integrity by adding guard trace with periodic structure
Yuho Terai, Yoshitaka Toyota, Kengo Iokibe (Okayama Univ.), Tetsushi Watanabe (Industrial Technology Center of Okayama Prefecture) EMCJ2013-1
The guard trace is effective as a method for suppressing common-mode generation caused by placing a signal trace close t... [more] EMCJ2013-1
pp.1-6
SANE 2012-10-10
17:00
Overseas The SONGDO CONVENSIA, Incheon Korea Integrity of ATCRBS Reply Data under Interference Environment
Shigeru Ozeki (ENRI) SANE2012-62
The integrity of surveillance data is one of the essential factors to estimate the safety of air traffic control system.... [more] SANE2012-62
pp.37-40
VLD, CPSY, RECONF, IPSJ-SLDM [detail] 2012-01-25
15:20
Kanagawa Hiyoshi Campus, Keio University A Proposal of Signal Integrity Improvement Method Using Impedance-reconfiguration Technique
Moritoshi Yasunaga, Hiroki Shimada, Shohei Akita, Takuya Adachi, Hidetoshi Ishijima, Yusuke Kuribara (Univ. of Tsukuba) VLD2011-100 CPSY2011-63 RECONF2011-59
New techniques are strongly desired for signal integrity improvement on PCB traces in GHz-era because conventional imped... [more] VLD2011-100 CPSY2011-63 RECONF2011-59
pp.55-60
VLD, DC, IPSJ-SLDM, CPSY, RECONF, ICD, CPM
(Joint) [detail]
2011-11-28
14:40
Miyazaki NewWelCity Miyazaki Waveform-Improvement of High-speed Signals on Branch Traces on PCBs
Yusuke Kuribara, Shohei Akita, Hiroki Shimada, Takuya Adachi, Hidetoshi Ishijima (Univ. Tsukuba), Ikuo Yoshihara (Univ. Miyazaki), Moritoshi Yasunaga (Univ. Tsukuba) CPM2011-152 ICD2011-84
Recently, it is a serious problem that the signal integrity of high-speed signals transmitting on PCB traces deteriorate... [more] CPM2011-152 ICD2011-84
pp.19-24
EMD 2011-11-18
10:40
Akita Akita Univ. Tegata Campus [Invited Talk] High-Speed Connector and Cable Design -- Signal Integrity and Electromagnetic Interference Considerations --
Jun Fan (Missouri Univ. of Science and Tech.) EMD2011-93
In this invited talk, challenges and common practices to maintain signal integrity and mitigate electromagnetic interfer... [more] EMD2011-93
pp.141-146
VLD, DC, IPSJ-SLDM, CPSY, RECONF, ICD, CPM
(Joint) [detail]
2010-11-29
11:40
Fukuoka Kyushu University Evaluation of Signal-Integrity Improvement Capability of the Segmental Transmission Line -- In Its Application to Lines Including Inductances --
Hiroki Shimada, Shohei Akita, Masami Ishiguro, Moritoshi Yasunaga, Noriyuki Aibe (Univ. of Tsukuba), Ikuo Yoshihara (Univ. of Miyazaki) CPM2010-127 ICD2010-86
In recent years, signal integrity(SI) is becoming very serious problem in the area of transmitting high-frequency-digita... [more] CPM2010-127 ICD2010-86
pp.19-24
VLD, DC, IPSJ-SLDM, CPSY, RECONF, ICD, CPM
(Joint) [detail]
2010-11-29
14:10
Fukuoka Kyushu University [Invited Talk] Present Status and Target Issue of LSI-Chip Optical Interconnection
Keishi Ohashi (MIRAI-Selete/NEC), Tohru Mogami (MIRAI-Selete) CPM2010-129 ICD2010-88
On-chip optical interconnection is expected to give an answer to the problems on signal integrity and data band width. C... [more] CPM2010-129 ICD2010-88
pp.31-36
CAS
(2nd)
2010-10-06
11:45
Chiba Makuhari Messe [Invited Talk] PI/SI/EMI simulation technology for high-speed electronic design
Hideki Asai (Shizuoka Univ.)
A variety of noise problems, such as signal integrity, power integrity and electromagnetic interference have become very... [more]
 Results 1 - 20 of 42  /  [Next]  
Choose a download format for default settings. [NEW !!]
Text format pLaTeX format CSV format BibTeX format
Copyright and reproduction : All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)


[Return to Top Page]

[Return to IEICE Web Page]


The Institute of Electronics, Information and Communication Engineers (IEICE), Japan