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All Technical Committee Conferences (Searched in: All Years)
| Committee | Date Time | Place | Paper Title / Authors | Abstract | Paper # | |
| ED, MW | 2024-01-25 14:00 |
Tokyo | Kikai-Shinko-Kaikan Bldg. (Primary: On-site, Secondary: Online) |
Reduction of Wafer Warpage in GaAs Semiconductor Process Koichiro Nishizawa (Mitsubishi Electric), Ayumu Matsumoto, Naoki Fukumuro (University of Hyogo), Yasuyuki Nakagawa, Takayuki Hisaka, Hitoshi Sakuma, Yoshiki Kojima (Mitsubishi Electric), Shinji Yae (University of Hyogo)  ED2023-65 MW2023-157 |
The Ni-P plating film used for the back electrode of GaAs semiconductors has high stress, which is a factor in wafer war... [more] | ED2023-65 MW2023-157 pp.1-3 |
| CPM, ED, LQE | 2022-11-24 11:35 |
Aichi | Winc Aichi (Aichi Industry & Labor Center) (Primary: On-site, Secondary: Online) |
Semiconducting properties of electrochemically deposited Ni(OH)2 thin films Masahide Shimura, Koji Abe (Nitech) ED2022-28 CPM2022-53 LQE2022-61 |
Abstract Metal hydroxides are important inorganic materials used as flame retardants and precursors for metal oxide syn... [more] | ED2022-28 CPM2022-53 LQE2022-61 pp.23-26 |
| MRIS, ITE-MMS, IEE-MAG | 2019-10-18 11:00 |
Fukuoka | Kyushu University (Nishijin Plaza) | Effects of annealing on structural and magnetic properties of nickel hydroxide nanosheets Masahiro Hara, Haruki Kobayashi, Asami Funatsu, Shintaro Ida, Fuyuki Shimojo (Kumamoto Univ.) MRIS2019-31 |
We investigated structural and magnetization changes of nickel hydroxide nanosheets deposited on a Si substrate under va... [more] | MRIS2019-31 pp.91-94 |
| MW, EMCJ, EST, IEE-EMC [detail] | 2017-10-19 13:55 |
Akita | Yupopo | Study of Via Hole on MMIC using Nickel Layer Takahiro Tsushima, Masayuki Kimishima (AT Lab.) EMCJ2017-33 MW2017-85 EST2017-48 |
In MMIC (Microwave Monolithic Integrated Circuit) and PCB (Printed Circuit Board), nickel plating is widely used. Howeve... [more] | EMCJ2017-33 MW2017-85 EST2017-48 pp.41-44 |
| R | 2016-06-17 14:50 |
Tokyo | Kikai-Shinko-Kaikan Bldg. | The Study of Electroless Nickel Plating -Surface Morphology and Hardening Behavior- Rieko Mizuuchi, Yuji Hisazato, Kazuya Kodani (Toshiba) R2016-12 |
Electroless nickel plating is widely used in industry. Electroless nickel plating has the following features, excellent... [more] | R2016-12 pp.19-24 |
| EMD | 2016-05-20 14:50 |
Hokkaido | Chitose Arcadia Plaza | Influence of electrical contact material on breaking characteristics of arc discharge at DC high voltage
-- Experimental results from DC200 to 500V of various materials -- Kiyoshi Yoshida, Koichiro Sawa, Hikaru Kanou, Hiroto Yamagishi (NIT), Kenji Suzuki, Koetsu Takaya (Fuji FA Comp.& Sys.) EMD2016-4 |
The experimental apparatus that is able to set opening velocity at wide-range of 1-200mm/s with an equal speed was used ... [more] | EMD2016-4 pp.19-24 |
| EMD | 2015-01-23 15:25 |
Kanagawa | A Basic consideration of a frequency interval dependency for the non-contact two-tone PIM tests using standing wave coaxial tube method Kumiko Morita, Nobuhiro Kuga (Yokohama Nat'l Univ.) EMD2014-105 |
This report discuss the influence of the frequency separation ware examined by a frequency sweep in the 2GHz narrow band... [more] | EMD2014-105 pp.19-22 |
|
| US | 2014-12-15 15:50 |
Tokyo | Tokyo Institute of Technology, Suzukakedai Campus | Ultrasonic Welding of Electronic Parts and Devices Using a Long and Thin Complex Transverse Vibration Welding Tip
-- Ultrasonic complex vibration welding of narrow and deep welding positions -- Jiromaru Tsujino (Kanagawa Univ./Asahi EMS) US2014-70 |
Ultrasonic complex vibration welding was applied for deep and narrow area of electronic parts positioned at long distanc... [more] | US2014-70 pp.29-34 |
| SDM, EID | 2014-12-12 17:30 |
Kyoto | Kyoto University | Resistive switching characteristics of NiO-based ReRAM after semi-forming process. Hiroki Sasakura, Yusuke Nishi, Tatsuya Iwata, Tsunenobu Kimoto (Kyoto Univ.) EID2014-38 SDM2014-133 |
In our previous work, forming processes showing two kinds of modes in resistive switching memory (ReRAM) based on NiO de... [more] | EID2014-38 SDM2014-133 pp.129-134 |
| OME, OPE | 2014-11-21 15:10 |
Tokyo | Fabrication of NiO-based p-type photo electrodes for high-voltage dye sensitized tandem solar cell Akiumi Oba, Hiroshi Yamauchi, Shigekazu Kuniyoshi, Masatoshi Sakai, Masaaki Iizuka (Chiba Univ.), Yasuyuki Watanabe (Tokyo Univ. of Science, Suwa), Kazuhiro Kudo (Chiba Univ.) OME2014-52 OPE2014-132 |
The hydrogen generation using electrolysis of water is the most expected way of energy production due to unlimited solar... [more] | OME2014-52 OPE2014-132 pp.29-33 |
|
| OME | 2013-12-17 17:20 |
Tokyo | Kikai-Shinko-Kaikan Bldg | [Invited Talk]
Evaluation of Components in Fuel Cell and Electrochemical Measurements Kazuhiko Noda, Youhei Hirohata, Ryouji Suzuki, Kohei Ito, Yuta Yagi (Shibaura Inst. of Tech.) OME2013-85 |
In order to diffuse PEFC, development of new PEFC separator with high intensity, lightweight and low cost is necessary. ... [more] | OME2013-85 pp.35-38 |
| SDM, ED (Workshop) |
2012-06-28 10:40 |
Okinawa | Okinawa Seinen-kaikan | [Poster Presentation]
The surface morphology and electrical properties of NiO with various RF power and O2/(Ar+O2) gas mixture Jonghun Kim, Gyohun Koo, Changju Lee, Sungho Hahm (Kyungpook National Univ.), Youngchul Jung (Gyeongju Univ.), Yougsoo Lee (Kyungpook National Univ.) |
The crystalline structures of reactively sputtered nickel oxide films grown on SiO2/Si were systematically analyzed by a... [more] | |
| CPM | 2010-10-28 16:40 |
Nagano | Structure and electric properties of RF-sputtered p-type nickel oxide thin films Atsushi Nagata, Kazuo Uchida, Atsushi Koizumi, Hiroshi Ono, Shinji Nozaki (UEC) CPM2010-96 |
NiOx as a transparent oxide semiconductor has been known long to show an intrinsic p-type conductivity although most of ... [more] | CPM2010-96 pp.27-31 |
|
| SDM | 2010-06-22 09:55 |
Tokyo | An401・402 Inst. Indus. Sci., The Univ. of Tokyo | Development of Silicon Nanowire MOSFETs through Atomic-Scale Design Concepts Shinji Migita, Yukinori Morita, Hiroyuki Ota (AIST) SDM2010-34 |
Process technology with atomic-scale precision is indispensable for fabrication of silicon nanowire MOSFETs. We present ... [more] | SDM2010-34 pp.5-10 |
| ITE-IDY, EID, IEIJ-SSL, IEE-EDD | 2010-01-29 11:35 |
Fukuoka | Kyusyu Univ. (Chikushi Campus) | Line Spacers of Flexible Liquid Crystal Divice Formed by Roller Nanoimprint Technique Yamato Nishimura, Hirokazu Furue (Tokyo Univ. of Sci.), Hiroto Sato, Hiroshi Kikuchi, Hideo Fujikake (NHK) EID2009-76 |
In flexible liquid crystal (LC) displays, the electrooptic properties of the LC layer is changed and display image is di... [more] | EID2009-76 pp.119-122 |
| EMD | 2008-12-19 13:55 |
Tokyo | Tamagawa Univ. | Magnetic Pulse Welding of Various Metal Foils such as Copper, Nickel, Stainless Steel Tomokatsu Aizawa, Keigo Okagawa (Tokyo Metropolitan College. of Industrial Tech.) EMD2008-107 |
This paper describes a foil welding technique by applying pulsed magnetic pressure and its experimental results for vari... [more] | EMD2008-107 pp.5-10 |
| EE, CPM | 2008-02-22 11:40 |
Tokyo | Kikai-Shinko-Kaikan Bldg. | Outdoor power-supply System Using Nickel Metal Hydride Batteries Riichi Kitano, Akihiro Miyasaka, Akira Yamashita, Takahisa Shodai (NTT) EE2007-70 CPM2007-155 |
We developed an outdoor power-supply system which powers disaster-response systems when commercial power sources are dam... [more] | EE2007-70 CPM2007-155 pp.37-41 |
| EE, CPM | 2005-01-21 09:30 |
Tokyo | Kikai-Shinko-Kaikan Bldg. | Development of large scale Ni-MH cell Kazuo Tsutsumi (KHI) |
Large scale nickel-metal hydride battery is developed for industrial use as a power source and a energy storage. Nickel... [more] |
EE2004-48 CPM2004-143 pp.5-9 |
| EE, CPM | 2005-01-21 10:00 |
Tokyo | Kikai-Shinko-Kaikan Bldg. | [Invited Talk]
The cause of the memory effect observed in Ni/MH batteries and an trial of the suppression of the momory effect Yuichi Sato (Kanagawa Univ.) |
When nickel-hydrogen batteries loaded on hybrid cars were underwent repeated charge-discharge cycling, a lower working v... [more] | EE2004-49 CPM2004-144 pp.11-16 |
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