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Committee Date Time Place Paper Title / Authors Abstract Paper #
EMCJ, EMD 2010-07-16
13:00		 Tokyo Kikai-Shinko-Kaikan Bldg. Comparison of Magnetic Pulse Welding and Resistance Spot Welding for Flat Wires
Tomokatsu Aizawa, Keigo Okagawa (Tokyo Metropolitan College), Yuho Yoshida (Yokodai.JP) EMCJ2010-33 EMD2010-18		 This paper describes the comparison and experiments of magnetic pulse welding and resistance spot welding for lapped fla... [more] EMCJ2010-33 EMD2010-18
pp.7-12
SDM 2008-03-14
15:00		 Tokyo Kikai-Shinko-Kaikan Bldg. Compliant Micro-Bumps for 3D Stacked-Chip LSIs with High Density Interconnection Implemented at Low Temperature
Naoya Watanabe (Kumamoto TIF), Yutaka Iwasaki, Tanemasa Asano (Kyushu Univ.) SDM2007-276		 We have proposed the compliant bump. The compliant bump, which can be made in the shape of pyramid or cone, has the pote... [more] SDM2007-276
pp.17-20
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