Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
ITE-IDY, EID, SID-JC [detail] |
2019-08-02 15:05 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
[Invited Lecture]
Characterization of Metal Thin Film-Wiring Materials for Foldable Displays Chiharu Kura, Yumi Teramae, Yuki Tauchi (KOBELCO), Hiroshi Goto, Hiroyuki Okuno (Kobelco Research Institute) |
Recently, flexible displays are receiving a lot of attention, and the demands of flexible displays are expected to incre... [more] |
|
HWS, VLD |
2019-02-27 13:30 |
Okinawa |
Okinawa Ken Seinen Kaikan |
Routing Algorithm to Achieve Circular Wire for SIM-Type SADP Shun Akatsuka, Kunihiro Fujiyoshi (TUAT) VLD2018-98 HWS2018-61 |
Wires of Spacer-Is-Metal (SIM) type Self-Aligned Double Patterning (SADP) is peculiar since wires is circular when dummy... [more] |
VLD2018-98 HWS2018-61 pp.31-36 |
LQE, OPE, SIPH |
2018-12-06 17:10 |
Tokyo |
Keio University |
Numerical design of metal-clad cavity device coupled to InP waveguide for on-chip optical interconnect Yuguang Wang, Yi Xiao, Takuo Tanemura, Yoshiaki Nakano (Tokyo Univ.) OPE2018-106 LQE2018-116 SIPH2018-22 |
We propose a horn-shaped metal-clad cavity which is integrated with an InP waveguide. The simulation by finite differenc... [more] |
OPE2018-106 LQE2018-116 SIPH2018-22 pp.43-46 |
LQE, OPE, SIPH |
2018-12-06 17:10 |
Tokyo |
Keio University |
Topology optimization of metal-clad wavelength-scale cavity structure for ultra-compact light source Mitsuhiro Watanabe, Xiao Yi, Takuo Tanemura, Yoshiaki Nakano (The Univ. of Tokyo) OPE2018-107 LQE2018-117 SIPH2018-23 |
Metal-clad wavelength-scale cavities have been expected for application to ultra-small light sources in on-chip optical ... [more] |
OPE2018-107 LQE2018-117 SIPH2018-23 pp.47-52 |
CAS, SIP, MSS, VLD |
2018-06-15 15:25 |
Hokkaido |
Hokkaido Univ. (Frontier Research in Applied Sciences Build.) |
Routing Algorithm to Achieve Circular Wire for SIM-Type SADP Shun Akatsuka, Kunihiro Fujiyoshi (TUAT) CAS2018-30 VLD2018-33 SIP2018-50 MSS2018-30 |
Wires of Spacer-Is-Metal (SIM) type Self-Aligned Double Patterning (SADP) is peculiar since wires is circular when dummy... [more] |
CAS2018-30 VLD2018-33 SIP2018-50 MSS2018-30 pp.155-160 |
CPM |
2015-11-06 15:15 |
Niigata |
Machinaka Campus Nagaoka |
Properties of transition metal nitride deposited by combination of sputtering and radical treatment Mayumi B. Takeyama, Masaru Sato (Kitami Inst. of Technol.), Eiji Aoyagi (Tohoku Univ.), Atsushi Noya (Kitami Inst. of Technol.) CPM2015-89 |
We have proposed the low temperature deposition method of preparing transition metal nitride films by combination of spu... [more] |
CPM2015-89 pp.27-30 |
OPE |
2013-12-20 15:00 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
Metal mirror assisted grating couplers between multilayered waveguides toward 3D optical interconnects JoonHyun Kang, Yuki Atsumi, Yusuke Hayashi, Junichi Suzuki, Yuki Kuno, Tomohiro Amemiya, Nobuhiko Nishiyama, Shigehisa Arai (Tokyo Tech) OPE2013-142 |
Silicon photonics for optical interconnects can further improve the signal transmission density by introducing multilaye... [more] |
OPE2013-142 pp.25-30 |
LQE |
2013-12-13 09:35 |
Tokyo |
|
Design of Capsule-Shaped Cavity for Nanometallic Semiconductor Lasers Baifu Zhang, Takuya Okimoto, Takuo Tanemura, Yoshiaki Nakano (Univ. of Tokyo) LQE2013-125 |
We propose a novel subwavelength metallic InP/InGaAs laser with a capsule-shaped cavity. By introducing curved metallic ... [more] |
LQE2013-125 pp.1-6 |
CPM |
2012-10-26 17:55 |
Niigata |
|
Interfacial reaction and/or diffusion in Cu/metal/SiO2/Si system (I)
-- Diffusion behavior of Va transition metal -- Mayumi B. Takeyama, Atsushi Noya (Kitami Inst. of Technol.) CPM2012-103 |
Cu multi-level interconnects in Si-LSIs require an effective barrier metal between Cu and a field insulating layer as a ... [more] |
CPM2012-103 pp.55-60 |
CPM |
2011-08-10 15:20 |
Aomori |
|
Properties of ZrBx Thin Films with Off-stoichiometry from ZrB2 Compound Mayumi B. Takeyama, Masaru Sato, Atsushi Noya (Kitami Inst. of Technol.) CPM2011-61 |
We have examined characteristics of ZrBx thin films with off-stoichiometry from the ZrB2 compound as an application as a... [more] |
CPM2011-61 pp.27-30 |
SDM |
2011-02-07 16:25 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
Highly Manufacturable ELK Integration Technology with Metal Hard Mask Process for High Performance 32nm-node Interconnect and Beyond S. Matsumoto, T. Harada, Y. Morinaga, D. Inagaki, J. Shibata, K. Tashiro, T. Kabe, Akihisa Iwasaki, S. Hirao, M. Tsutsue, K. Nomura, K. Seo, T. Hinomura, Naoki Torazawa, S. Suzuki (Panasonic) SDM2010-226 |
High performance 32nm-node interconnect with ELK (Extremely Low-k, k=2.4) has been demonstrated. The two main key techno... [more] |
SDM2010-226 pp.59-63 |
VLD, DC, IPSJ-SLDM, CPSY, RECONF, ICD, CPM (Joint) [detail] |
2010-11-29 13:30 |
Fukuoka |
Kyushu University |
[Invited Talk]
Problems of on-chip interconnection and optical interconnection Shin Yokoyama, Yoshiteru Amemiya (Hiroshima Univ.) CPM2010-128 ICD2010-87 |
The problems of current LSI with metal interconnection are pointed out, i.e., increasing signal delay and power dissipat... [more] |
CPM2010-128 ICD2010-87 pp.25-30 |
SDM |
2010-02-05 14:00 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
Low resistive and highly reliable copper interconnects in combination of silicide-cap with Ti-barrier for 32 nm-node and beyond Yumi Hayashi, Noriaki Matsunaga, Makoto Wada, Shinichi Nakao, Atsuko Sakata, Kei Watanabe, Hideki Shibata (Toshiba) SDM2009-187 |
Silicide-cap for Cu interconnects is promising for enhancing electromigration (EM) performance for 32 nm-node and beyond... [more] |
SDM2009-187 pp.31-36 |
CPM |
2009-08-11 10:50 |
Aomori |
Hirosaki Univ. |
Properties of ZrBx Thin Film Applicable to Cu Interconnects in Si-ULSI Mayumi B. Takeyama, Masaru Sato (Kitami Inst. of Tech.), Yuichiro Hayasaka, Eiji Aoyagi (Tohoku Univ.), Atsushi Noya (Kitami Inst. of Tech.) CPM2009-43 |
We have examined characteristics of ZrB2 films and found a peculiar property that the resistivity of the film depends on... [more] |
CPM2009-43 pp.51-55 |
ED |
2008-06-13 15:20 |
Ishikawa |
Kanazawa University |
Wet Cleaning Processing of VLSI Devices by Functional Waters Masako Kodera, Yoshitaka Matsui, Naoto Miyashita (Toshiba) ED2008-27 |
We applied functional waters that was generated by an electrolytic cell of de-ionized water (DIW) or by gas-injecting me... [more] |
ED2008-27 pp.29-34 |