Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
SDM |
2024-02-21 14:10 |
Tokyo |
Tokyo University-Hongo-Engineering Bldg.4 (Primary: On-site, Secondary: Online) |
[Invited Talk]
Optimization of Pre-Bonding Surface for Cu/SiCN Hybrid Bonding Kohei Nakayama, Kenta Hayama, Yutesu Kamiya, Fmihiro Inoue (YNU) SDM2023-85 |
Hybrid bonding is considered the key enabler for advanced chiplet integration, which requires finer pitch vertical conne... [more] |
SDM2023-85 pp.20-26 |
SAT, KOSST |
2023-10-11 14:30 |
Overseas |
Central Hotel Marianne(Korea, Busan) (Primary: On-site, Secondary: Online) |
Validation of Transmission Power Control in Hybrid FSO/RF Space-Air-Ground Integrated Networks Kazuma Mashiko, Yuichi Kawamoto, Nei Kato (Tohoku Univ.) SAT2023-56 |
With the increasing demand for communication owing to the widespread adoption of Internet of Things (IoT) devices, there... [more] |
SAT2023-56 pp.45-49 |
SDM |
2020-02-07 14:55 |
Tokyo |
Tokyo University-Hongo |
[Invited Talk]
A THIN BONDING MATERIAL FOR HIGH DENSITY HETEROGENEOUS INTEGRATION Yasuhisa Kayaba, Yuzo Nakamura, Jun Kamada, Takashi Kozeki, Kazuo Kohmura (MCI) SDM2019-95 |
A new thin bonding material was developed for the heterogeneous device chip integration by Cu-Cu hybrid bonding. The bon... [more] |
SDM2019-95 pp.31-34 |
SCE |
2020-01-17 13:15 |
Kanagawa |
|
[Poster Presentation]
Optimization of a Josephson latching driver using 10-kA/cm2 Nb process for a Josephson-CMOS hybrid memory Yuki Hironaka, Yuki Yamanashi, Nobuyuki Yoshikawa (Yokohama Natl. Univ.) SCE2019-47 |
Josephson digital circuits such as single flux quantum circuits have a great potential for future high-end computing sys... [more] |
SCE2019-47 pp.73-74 |
OCS, LQE, OPE |
2019-10-17 09:35 |
Kagoshima |
|
Efficient Optical Alignment Technique for Multi-Lane TOSAs with Integrated Multiplexing with Free Space Optics Tadashi Murao, Keita Mochizuki, Kazutaka Ikeda, Mizuki Shirao, Kiyotomo Hasegawa, Hiroshi Aruga (Mitsubishi Electric) OCS2019-27 OPE2019-65 LQE2019-43 |
An efficient and low-cost optical alignment technique is for the first time established for compact multi-lane transmitt... [more] |
OCS2019-27 OPE2019-65 LQE2019-43 pp.1-6 |
LQE, OPE, CPM, EMD, R |
2019-08-22 13:30 |
Miyagi |
|
[Invited Talk]
Progress of InP-based Monolithically Integrated Photonic Devices and Future Prospect Towards Beyond Tbps Era Hideki Yagi (SEI) R2019-20 EMD2019-18 CPM2019-19 OPE2019-47 LQE2019-25 |
InP-based photonic devices have yielded the monolithic integration of
various functionalities in addition to miniaturi... [more] |
R2019-20 EMD2019-18 CPM2019-19 OPE2019-47 LQE2019-25 pp.5-9 |
MW, ICD |
2019-03-15 10:35 |
Okinawa |
|
A 0.85mm2 BLE Transceiver with Embedded T/R Switch, 2.6mW Harmonic Suppressed Transmitter and 2.3mW Hybrid-Loop Receiver Zheng Sun, Hanli Liu, Dexian Tang, Hongye Huang, Tohru Kaneko, Rui Wu, Wei Deng, Teruki Someya, Atsushi Shirane, Kenichi Okada (Tokyo Tech) MW2018-171 ICD2018-115 |
This paper presents a miniaturized Bluetooth Low-Energy transceiver (TRX) for short-range IoT applications in 65-nm CMOS... [more] |
MW2018-171 ICD2018-115 pp.81-85 |
LQE, OPE, SIPH |
2018-12-06 17:10 |
Tokyo |
Keio University |
High optical coupling efficiency by double taper-type coupler structure towards III-V/Si hybrid photonic integration Takehiko Kikuchi (SEI/Tokyo Tech.), Junichi Suzuki, Fumihito Tachibana (Tokyo Tech.), Naoko Inoue, Hideki Yagi (SEI), Moataz Eissa, Takuya Mitarai, Tomohiro Amemiya, Nobuhiko Nishiyama, Shigehisa Arai (Tokyo Tech.) OPE2018-129 LQE2018-139 SIPH2018-45 |
The hybrid integration utilizing III-V based active devices with Si-Photonics is very attractive to realize new-generati... [more] |
OPE2018-129 LQE2018-139 SIPH2018-45 pp.161-164 |
OPE, LQE, OCS |
2018-10-18 13:10 |
Saga |
|
[Memorial Lecture]
Research and development of high-density integrated silica-based planar lightwave circuits Senichi Suzuki (NEL) OCS2018-33 OPE2018-69 LQE2018-58 |
Silica-based planar lightwave circuits (PLCs) with highly design flexibility and low loss characteristics have provided ... [more] |
OCS2018-33 OPE2018-69 LQE2018-58 pp.29-33 |
PN |
2018-09-04 09:30 |
Hokkaido |
Hotel DAIHEIGEN (Tokachi) |
[Invited Talk]
Assembly Technologies for Integrated Optical Transmitter/Receiver Modules for Optical Communication Systems Keita Mochizuki, Tadashi Murao, Masamichi Nogami, Hiroshi Aruga (Mitsubishi Electric Corp.) PN2018-20 |
The rapid growth of data traffic requires high capacity optical transmission systems. To meet this demand, the baud rate... [more] |
PN2018-20 pp.33-36 |
LQE |
2018-07-12 14:20 |
Hokkaido |
|
Hybrid-Integration Technologies of InP-SOA on Silicon Optical Platform Takeshi Matsumoto, Teruo Kurahashi (Fujitsu Lab), Ryotaro Konoike, Keijiro Suzuki, Ken Tanizawa (AIST), Ayahito Uetake, Kazumasa Takabayashi (Fujitsu Lab), Kazuhiro Ikeda, Hitoshi Kawashima (AIST), Suguru Akiyama, Shigeaki Sekiguchi (Fujitsu Lab) LQE2018-23 |
We investigated hybrid-integration technologies of semiconductor optical amplifiers (SOAs) on Si optical platforms for o... [more] |
LQE2018-23 pp.13-16 |
LQE |
2018-07-12 15:45 |
Hokkaido |
|
[Invited Talk]
What will be a compelling technology for beyond-400 Gbps systems; Devices vs. Packaging
-- Progress of InP-based Coherent Receivers and Future Prospect of Photonic Integrated Circuits -- Hideki Yagi, Naoko Inoue (SEI), Takuya Okimoto (SEDI), Takehiko Kikuchi (SEI) LQE2018-27 |
Currently, digital coherent transmission using spectrally-efficient modulation formats has been widely applied to not on... [more] |
LQE2018-27 pp.29-32 |
AP |
2018-02-16 14:55 |
Tokyo |
Kozo Keikaku Engineering, Inc. |
Self-Interference Suppression of Receiving Antenna Array Integrated with 180 Degree Hybrid Circuits for MIMO Full-Duplex System Qiaowei Yuan, Riri Niizeki, Yudai Hashimoto (NIT, Sendai Collge), Yoshiyuki Yamamoto (Tohoku Univ.), Naoki Honma (Iwate Univ.), Quiang Chen (Tohoku Univ.) AP2017-187 |
Self-Interference suppression is essential for realizing the MIMO Full-Duplex system. The self-interference suppression ... [more] |
AP2017-187 pp.63-66 |
MWP |
2017-11-09 14:05 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
[Invited Talk]
Packaging of LiNbO3 optical device by low-temperature Au-Au bonding in ambient air Ryo Takigawa (Kyushu Univ.) MWP2017-46 |
As an alternative to conventional AuSn solder bonding, we have developed low-temperature solid-state bonding method of A... [more] |
MWP2017-46 pp.7-11 |
LQE |
2016-12-16 14:30 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
[Invited Talk]
InP-Based Monolithically Integrated Photonic Devices
-- Current Status and Future Prospect -- Hideki Yagi, Toshimitsu Kaneko, Hiroyuki Yoshinaga, Hajime Shoji (SEI) LQE2016-103 |
InP-based photonic devices have yielded monolithic integration of various functionalities in addition to miniaturization... [more] |
LQE2016-103 pp.33-36 |
LQE, LSJ |
2015-05-22 15:20 |
Ishikawa |
|
Integrated Spatial Optical System for Compact 100GbE Transmitter Optical Sub-Assemblies Using Lens Positional Control by Laser Irradiation Tadashi Murao, Nobuyuki Yasui, Takuro Shinada, Yudai Imai, Koichi Nakamura, Masaya Shimono, Hidekazu Kodera, Yoshimichi Morita, Asami Uchiyama, Haruki Koyanagi, Hiroshi Aruga (Mitsubishi Electric) LQE2015-19 |
A compact transmitter optical sub-assembly (TOSA) is developed for 100 Gbps Ethernet (100GbE)/ OTU4 applications with a ... [more] |
LQE2015-19 pp.93-97 |
OCS, OPE |
2015-05-15 15:55 |
Tokyo |
Kikai-Shinko-Kaikan Bldg(Tokyo) |
Investigation of III-V/Si Hybrid Laser with Ring-resonator-type Reflector for One-chip Router Yusuke Hayashi, Junichi Suzuki, Satoshi Inoue, Shovon MD Tanvir Hasan, Yuki Kuno, Tomohiro Amemiya, Nobuhiko Nishiyama, Shigehisa Arai (Titech) OCS2015-7 OPE2015-7 |
III-V/Si hybrid integration with direct bonding is an attractive way to realize small and low power consumption electro-... [more] |
OCS2015-7 OPE2015-7 pp.27-32 |
SIS |
2014-12-18 15:50 |
Kyoto |
Kyoto Research Park (Kyoto City) |
[Invited Talk]
A Hybrid Systems Approach to Modeling and Learning Multimedia Timing Structures Hiroaki Kawashima (Kyoto Univ.) SIS2014-78 |
Capturing dynamic events of human body motion, facial action, and speech, via sensors, e.g., cameras and microphones, we... [more] |
SIS2014-78 pp.63-68 |
LQE |
2013-12-13 11:15 |
Tokyo |
|
Investigation of InP/Si Hybrid Multi-functional Optical Dvice Structure Junichi Suzuki, Keita Fukuda, Yusuke Hayashi, JoonHyun Kang, Yuki Atsumi, Nobuhiko Nishiyama, Shigehisa Arai (Tokyo Inst. of Tech.) LQE2013-129 |
III-V/Si hybrid integration with direct bonding is an attractive way to realize one-chip optical router. In this paper, ... [more] |
LQE2013-129 pp.21-26 |
LQE, OCS, OPE |
2013-10-24 16:45 |
Fukuoka |
|
InP-Based Photodetector Monolithically Integrated with 90°Hybrid for High-Sensitive Coherent Receiver Yoshihiro Yoneda, Naoko Inoue, Hideki Yagi, Yutaka Onishi, Ryuji Masuyama, Tomokazu Katsuyama, Takehiko Kikuchi, Yoshihiro Tateiwa, Masaru Takechi, Hajime Shoji (SEI) OCS2013-61 OPE2013-107 LQE2013-77 |
Application spaces for digital coherent systems have a possibility that spreads from long-haul networks to metro network... [more] |
OCS2013-61 OPE2013-107 LQE2013-77 pp.63-66 |